SLLSEI8D June   2014  – April 2015 ISO7310C , ISO7310FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Insulation and Safety-Related Specifications for D-8 Package
        2. 8.3.1.2 Insulation Characteristics
        3. 8.3.1.3 Regulatory Information
        4. 8.3.1.4 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Typical Supply Current Equations
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 PCB Material
    2. 11.2 Layout Guidelines
    3. 11.3 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Signaling Rate: 25 Mbps
  • Integrated Noise Filter at the Input
  • Default Output 'High' and 'Low' Options
  • Low Power Consumption: Typical ICC
    • 1.9 mA at 1 Mbps, 3.8 mA at 25 Mbps (5V Supplies)
    • 1.4 mA at 1 Mbps, 2.6 mA at 25 Mbps (3.3V Supplies)
  • Low Propagation Delay: 32 ns Typical (5V Supplies)
  • 3.3 V and 5 V Level Translation
  • Wide TA Range Specified: –40°C to 125°C
  • 65 KV/μs Transient Immunity, Typical (5V Supplies)
  • Robust Electromagnetic Compatibility (EMC)
    • System-level ESD, EFT, and Surge Immunity
    • Low Emissions
  • Isolation Barrier Life: > 25 Years
  • Operates from 3.3 V and 5 V Supplies
  • Narrow Body SOIC-8 Package
  • Safety and Regulatory Approvals:
    • 4242 VPK Isolation per DIN V VDE V 0884-10 and DIN EN 61010-1
    • 3000 VRMS Isolation for 1 minute per UL 1577
    • CSA Component Acceptance Notice 5A,
      IEC 60950-1 and IEC 61010-1 End Equipment Standards
    • CQC Certification per GB4943.1-2011

2 Applications

  • Opto-Coupler Replacement in:
    • Industrial FieldBus
      • ProfiBus
      • ModBus
      • DeviceNet™ Data Buses
    • Servo Control Interface
    • Motor Control
    • Power Supplies
    • Battery Packs

3 Description

ISO7310x provide galvanic isolation up to 3000 VRMS for 1 minute per UL and 4242 VPK per VDE. These devices have one isolated channel comprised of a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, ISO7310x prevent noise currents on a data bus or other circuit from entering the local ground and interfering with or damaging sensitive circuitry. These devices have integrated noise filters for harsh industrial environment where short noise pulses may be present at the device input pins. ISO7310x have TTL input thresholds and operate from 3 V to 5.5 V supply levels. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7310x has been significantly enhanced to enable system-level ESD, EFT, Surge and Emissions compliance.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO7310C SOIC (8) 4,90mm x 3,91mm
ISO7310FC
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Schematic

ISO7310C ISO7310FC Simplified_Schematic_sllsei8.gif

4 Revision History

Changes from C Revision (March 2015) to D Revision

Changes from B Revision (September 2014) to C Revision

Changes from A Revision (July 2014) to B Revision

  • Added device ISO7310FC Go
  • Changed Feature From: 4242 VPK Isolation per DIN EN 60747-5-5 (VDE 0884-5) To: 4242 VPK Isolation per DIN V VDE 0884-10Go
  • Deleted "All Agencies Approvals Planned" from the Features Safety and Regulatory Approvals:Go
  • Replaced Figure 10Go
  • Changed DIN EN 60747-5-5 To: DIN V VDE 0884-10 in the Insulation CharacteristicsGo
  • Changed DIN EN 60747-5-5 (VDE 0884-5) To: DIN V VDE 0884-10 in the Regulatory Information tableGo
  • Added a NOTE in the Application Information section Go

Changes from * Revision (March 2014) to A Revision

  • Changed from a 1 page Product Preview to the full data sheet Go
  • Added Features - GB4943.1-2011 CQC Certification Go
  • Changed the Description to include: "Through innovative chip design..."Go
  • Changed the Simplified SchematicGo