JAJSFW1E June 2017 – March 2019 66AK2G12
PRODUCTION DATA.
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Figure 7-4 shows the required placement for the processor as well as the DDR3L devices. The dimensions for this figure are defined in Table 7-6. The placement does not restrict the side of the PCB on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR3L devices are omitted from the placement.
NO. | PARAMETER | MIN | MAX | UNIT |
---|---|---|---|---|
KOD31 | X1 | 500 | Mils | |
KOD32 | X2 | 600 | Mils | |
KOD33 | X3 | 600 | Mils | |
KOD34 | Y1 | 1800 | Mils | |
KOD35 | Y2 | 600 | Mils | |
KOD36 | DDR3L keepout region(1) | |||
KOD37 | Clearance from non-DDR3L signal traces to DDR3L signal traces (2) | 4 | W |