JAJSSY9 February   2024 ADC12DL1500 , ADC12DL2500 , ADC12DL500

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 5.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Characteristics - ADC12DL500
    13. 5.13 Typical Characteristics - ADC12DL1500 (1GSPS)
    14. 5.14 Typical Characteristics - ADC12DL1500 (1.5GSPS)
    15. 5.15 Typical Characteristics - ADC12DL2500 (2GSPS)
    16. 5.16 Typical Characteristics - ADC12DL2500 (2.5GSPS)
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Analog Input Protection
        2. 6.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.1.3 Analog Input Offset Adjust
      2. 6.3.2 ADC Core
        1. 6.3.2.1 ADC Theory of Operation
        2. 6.3.2.2 ADC Core Calibration
        3. 6.3.2.3 ADC Overrange Detection
        4. 6.3.2.4 Code Error Rate (CER)
        5. 6.3.2.5 Internal Dither
      3. 6.3.3 Timestamp
      4. 6.3.4 Clocking
        1. 6.3.4.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 6.3.4.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 6.3.4.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 6.3.4.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 6.3.4.3.2 Automatic SYSREF Calibration
      5. 6.3.5 LVDS Digital Interface
        1. 6.3.5.1 Multi-Device Synchronization and Deterministic Latency Using Strobes
          1. 6.3.5.1.1 Dedicated Strobe Pins
          2. 6.3.5.1.2 Reduced Width Interface With Dedicated Strobe Pins
          3. 6.3.5.1.3 LSB Replacement With a Strobe
          4. 6.3.5.1.4 Strobe Over All Data Pairs
      6. 6.3.6 Alarm Monitoring
        1. 6.3.6.1 Clock Upset Detection
      7. 6.3.7 Temperature Monitoring Diode
      8. 6.3.8 Analog Reference Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Dual-Channel Mode (Non-DES Mode)
      2. 6.4.2 Internal Dither Modes
      3. 6.4.3 Single-Channel Mode (DES Mode)
      4. 6.4.4 LVDS Output Driver Modes
      5. 6.4.5 LVDS Output Modes
        1. 6.4.5.1 Staggered Output Mode
        2. 6.4.5.2 Aligned Output Mode
        3. 6.4.5.3 Reducing the Number of Strobes
        4. 6.4.5.4 Reducing the Number of Data Clocks
        5. 6.4.5.5 Scrambling
        6. 6.4.5.6 Digital Interface Test Patterns and LVSD SYNC Functionality
          1. 6.4.5.6.1 Active Pattern
          2. 6.4.5.6.2 Synchronization Pattern
          3. 6.4.5.6.3 User-Defined Test Pattern
      6. 6.4.6 Power-Down Modes
      7. 6.4.7 Calibration Modes and Trimming
        1. 6.4.7.1 Foreground Calibration Mode
      8. 6.4.8 Offset Calibration
      9. 6.4.9 Trimming
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
        1. 6.5.1.1 SCS
        2. 6.5.1.2 SCLK
        3. 6.5.1.3 SDI
        4. 6.5.1.4 SDO
        5. 6.5.1.5 80
        6. 6.5.1.6 Streaming Mode
        7. 6.5.1.7 82
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Reconfigurable Dual-Channel 2.5GSPS or Single-Channel 5GSPS Oscilloscope
        1. 7.2.1.1 Design Requirements
          1. 7.2.1.1.1 Input Signal Path
          2. 7.2.1.1.2 Clocking
          3. 7.2.1.1.3 ADC12DLx500
        2. 7.2.1.2 Application Curves
    3. 7.3 Initialization Set Up
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Maps
    1. 8.1 SPI_REGISTER_MAP Registers
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3.7 Temperature Monitoring Diode

A built-in thermal monitoring diode is available on the TDIODE+ and TDIODE– pins. This diode facilitates temperature monitoring and characterization of the device in higher ambient temperature environments. Although the on-chip diode is not highly characterized, the diode can be used effectively by performing a baseline measurement (offset) at a known ambient or board temperature and creating a linear equation with the diode voltage slope provided in the Electrical Characteristics: DC Specifications table. Perform offset measurement with the device unpowered or with the PD pin asserted to minimize device self-heating. Recommended monitoring devices include the LM95233 device and similar remote-diode temperature monitoring products from Texas Instruments.