6.8 ADC14155 Converter Electrical Characteristics (Continued) Timing and AC Characteristics(11)
Unless otherwise specified, the following specifications apply: AGND = DGND = DRGND = 0 V, VA = VD = 3.3 V, VDR = 1.8 V, Internal VREF = 1 V, fCLK = 155 MHz, VCM = VRM, CL = 5 pF/pin, Differential Analog Input, Single-Ended Clock Mode, Offset Binary Format. Typical values are for TA = 25°C. Timing measurements are taken at 50% of the signal amplitude. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C(1)(4)(5)(2)
PARAMETER |
TEST CONDITIONS |
NOTES |
TYP(6) |
MIN |
MAX |
UNITS |
SUB-GROUPS |
|
Maximum clock frequency |
|
|
|
|
155 |
MHz |
|
|
Minimum clock frequency |
|
|
|
5 |
|
MHz |
|
|
Clock high time |
|
|
3.0 |
|
|
ns |
|
|
Clock low time |
|
|
3.0 |
|
|
ns |
|
|
Conversion latency |
|
See(13) |
|
|
8 |
Clock cycles |
|
tOD |
Output delay of CLK to DATA |
Relative to falling edge of CLK |
|
2.0 |
|
|
ns |
|
tSU |
Data output setup time |
Relative to DRDY |
See(12) |
2.1 |
1.22 |
|
ns |
|
tH |
Data output hold time |
Relative to DRDY |
See(12) |
2.1 |
1.83 |
|
ns |
|
tAD |
Aperture delay |
|
|
0.5 |
|
|
ns |
|
tAJ |
Aperture jitter |
|
|
0.08 |
|
|
ps rms |
|
|
Power down recovery time |
0.1 µF to GND on pins 43, 44; 10 µF and 0.1 µF between pins 43, 44; 0.1 µF and 10 µF to GND on pins 47, 48 |
|
3.0 |
|
|
ms |
|
(1) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0 V, unless otherwise specified.
(2) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10.
(3) The inputs are protected as shown below. Input voltage magnitudes above V
A or below GND will not damage this device, provided current is limited per
Note 5. However, errors in the A/D conversion can occur if the input goes above 2.6 V or below GND as described in the
Recommended Operating Conditions section.
(4) To ensure accuracy, it is required that |VA – VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
(5) With the test condition for VREF = 1 V (2-VP-P differential input), the 14-bit LSB is 122.1 µV.
(6) Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical specifications are not ensured.
(7) Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative full-scale.
(8) The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance.
(9) Optimum performance will be obtained by keeping the reference input in the 0.9-V to 1.1-V range. The LM4051CIM3-ADJ (SOT-23 package) is recommended for external reference applications.
(10) IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR = VDR(C0 × f0 + C1 × f1 +....C11 × f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling.
(11) Pre and post irradiation limits are identical to those listed in the Electrical Characteristics tables. Radiation testing is performed per MIL-STD-883, Test Method 1019.
(12) Specified by characterization.
(13) Specified by design.