JAJSP39A May 2022 – December 2022 ADS1285
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
The thermal pad does not carry device current but must be soldered and connected to the most negative power-supply voltage (AVSS). Because of the low power dissipation, PCB thermal vias can be omitted to provide space for bottom layer components under the device.