SLAS760D May 2011 – November 2015 ADS5263
PRODUCTION DATA.
MIN | MAX | UNIT | |
---|---|---|---|
Supply voltage, AVDD | –0.3 | 3.9 | V |
Supply voltage, LVDD | –0.3 | 2.2 | V |
Voltage between AGND and DRGND | –0.3 | 0.3 | V |
Voltage applied to analog input pins – INP_A, INM_A, INP_B, INM_B | –0.3 | minimum (3.6, AVDD + 0.3 V) | V |
Voltage applied to input pins – CLKP, CLKM, RESET, SCLK, SDATA, CSZ | –0.3 | AVDD + 0.3 | V |
Voltage applied to reference input pins | –0.3 | 2.8 | V |
Operating free-air temperature, TA | –40 | 85 | °C |
Operating junction temperature, TJ | 125 | °C | |
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
THERMAL METRIC(1) | ADS5263 | UNIT | |
---|---|---|---|
RGC (VQFN) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 20.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 6.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 2.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 2.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.4 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
DIGITAL INPUTS – RESET, SCLK, SDATA, CS, PDN, SYNC, INT/EXT | |||||||
VIH | High-level input voltage | All digital inputs support 1.8-V and 3.3-V CMOS logic levels. | 1.3 | V | |||
VIL | Low-level input voltage | 0.4 | V | ||||
IIH | High-level input current | SDATA, SCLK, CS (1) | VHIGH = 1.8 V | 5 | μA | ||
IIL | Low-level input current | SDATA, SCLK, CS | VLOW = 0 V | 0 | μA | ||
DIGITAL CMOS OUTPUT – SDOUT | |||||||
VOH | High-level output voltage | IOH = 100 µA | AVDD – 0.05 | V | |||
VOL | Low-level output voltage | IOL = 100 µA | 0.05 | V | |||
DIGITAL OUTPUTS – LVDS INTERFACE (OUT1P/M TO OUT8P/M, ADCLKP/M, LCLKP/M) | |||||||
VODH | High-level output differential voltage | With external 100-Ω termination | 275 | 370 | 465 | mV | |
VODL | Low-level output differential voltage | With external 100-Ω termination | –465 | –370 | –275 | mV | |
VOCM | Output common-mode voltage | 1000 | 1200 | 1400 | mV |
MIN | TYP | MAX | UNIT | |||
---|---|---|---|---|---|---|
tj | Aperture jitter | 220 | fs rms | |||
tA | Aperture delay | Time delay between rising edge of input clock and the actual sampling instant | 3 | ns | ||
Wake-up time | Time to valid data after coming out of STANDBY mode | 10 | μs | |||
Time to valid data after coming out of global power down | 60 | |||||
ADC latency | Latency of ADC alone, excludes the delay from input clock to output clock (tPDI), Figure 3 | 16 | Clock cycles | |||
2 WIRE, 8× SERIALIZATION (4) | ||||||
tsu | Data setup time | Data valid (5) to zero-crossing of LCLKP | 0.23 | ns | ||
th | Data hold time | Zero-crossing of LCLKP to data becoming invalid(5) | 0.31 | ns | ||
tPDI | Clock propagation delay | Input clock rising edge crossover to output frame clock ADCLKP rising edge crossover, tPDI = (ts/4) + tdelay | 6.8 | 8.8 | 10.8 | ns |
Variation of tPDI | Between two devices at same temperature and LVDD supply | ±0.6 | ns | |||
LVDS bit clock duty cycle | Duty cycle of differential clock, (LCLKP-LCLKM) | 50% | ||||
tRISE
tFALL |
Data rise time, Data fall time |
Rise time measured from –100 mV to 100 mV, Fall time measured from 100 mV to –100 mV 10 MSPS ≤ Sampling frequency ≤ 100 MSPS |
0.17 | ns | ||
tCLKRISE
tCLKFALL |
Output clock rise time, Output clock fall time |
Rise time measured from –100 mV to 100 mV Fall time measured from 100 mV to –100 mV 10 MSPS ≤ Sampling frequency ≤ 100 MSPS |
0.2 | ns |
SAMPLING FREQUENCY, MSPS | SETUP TIME | HOLD TIME | UNIT | ||||
---|---|---|---|---|---|---|---|
MIN | TYP | MAX | MIN | TYP | MAX | ||
100 | 0.23 | 0.31 | ns | ||||
80 | 0.47 | 0.47 | ns | ||||
65 | 0.56 | 0.7 | ns | ||||
50 | 0.66 | 1 | ns | ||||
20 | 2.7 | 2.8 | ns |
SAMPLING FREQUENCY, MSPS | SETUP TIME | HOLD TIME | UNIT | ||||
---|---|---|---|---|---|---|---|
MIN | TYP | MAX | MIN | TYP | MAX | ||
65 | 0.15 | 0.31 | ns | ||||
50 | 0.27 | 0.35 | ns | ||||
40 | 0.45 | 0.55 | ns | ||||
20 | 1.1 | 1.4 | ns | ||||
Clock Propagation Delay tPDI = (ts/8) + tdelay 10 MSPS < Sampling Frequency < 65 MSPS |
tdelay | ns | |||||
MIN | TYP | MAX | ns | ||||
6.8 | 8.8 | 10.8 | ns |
SAMPLING FREQUENCY, MSPS | SETUP TIME | HOLD TIME | UNIT | ||||
---|---|---|---|---|---|---|---|
MIN | TYP | MAX | MIN | TYP | MAX | ||
100 | 0.29 | 0.39 | ns | ||||
80 | 0.51 | 0.60 | ns | ||||
65 | 0.58 | 0.82 | ns | ||||
50 | 0.85 | 1.20 | ns | ||||
20 | 3.2 | 3.3 | ns | ||||
Clock Propagation Delay tPDI = (ts/3.5) + tdelay 10 MSPS < Sampling Frequency < 100 MSPS |
tdelay | ns | |||||
MIN | TYP | MAX | ns | ||||
6.8 | 8.8 | 10.8 | ns |
SAMPLING FREQUENCY, MSPS | SETUP TIME | HOLD TIME | UNIT | ||||
---|---|---|---|---|---|---|---|
MIN | TYP | MAX | MIN | TYP | MAX | ||
65 | 0.19 | 0.28 | ns | ||||
50 | 0.37 | 0.42 | ns | ||||
30 | 0.70 | 1.0 | ns | ||||
20 | 1.3 | 1.5 | ns | ||||
Clock Propagation Delay tPDI = (ts/7) + tdelay 10 MSPS < Sampling Frequency < 65 MSPS |
tdelay | ns | |||||
MIN | TYP | MAX | ns | ||||
6.8 | 8.8 | 10.8 | ns |
MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|
fSCLK | SCLK frequency (= 1/ tSCLK) | > DC | 20 | MHz | |
tSLOADS | CS to SCLK setup time | 25 | ns | ||
tSLOADH | SCLK to CS hold time | 25 | ns | ||
tDS | SDATA setup time | 25 | ns | ||
tDH | SDATA hold time | 25 | ns |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
t1 | Power-on delay | Delay from power up of AVDD and LVDD to RESET pulse active | 1 | ms | ||
t2 | Reset pulse duration | Pulse duration of active RESET signal | 50 | ns | ||
t3 | Register write delay | Delay from RESET disable to CS active | 100 | ns |
NOTE:
A high-going pulse on RESET pin is required in serial interface mode in case of initialization through hardware reset. For parallel interface operation, RESET has to be tied permanently HIGH.