SBAS523D October 2010 – September 2017 ADS7223 , ADS7263 , ADS8363
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage, AVDD to AGND or DVDD to DGND | –0.3 | 6 | V | |
Supply voltage, DVDD to AVDD | 1.2 × AVDD(2) | V | ||
Analog and reference input voltage with respect to AGND | AGND – 0.3 | AVDD + 0.3 | V | |
Digital input voltage with respect to DGND | DGND – 0.3 | DVDD + 0.3 | V | |
Ground voltage difference |AGND-DGND| | 0.3 | V | ||
Input current to any pin except supply pins | –10 | 10 | mA | |
Maximum virtual junction temperature, TJ | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
AVDD | Analog supply voltage | 5 | V | ||
DVDD | Digital supply voltage | 3.3 | V | ||
Operating temperature | –40 | 125 | °C |
THERMAL METRIC(1) | ADS8363, ADS7263, ADS7223 | UNIT | |
---|---|---|---|
RHB (VQFN) | |||
32 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 33.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 7.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 7.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.9 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
ANALOG INPUT | ||||||
FSR | Full-scale input range | (CHxxP – CHxxN) or CHxx to CMx | –VREF | +VREF | V | |
VIN | Absolute input voltage | CHxxx to AGND | –0.1 | AVDD + 0.1 | V | |
CIN | Input capacitance | CHxxx to AGND | 45 | pF | ||
CID | Differential input capacitance | 22.5 | pF | |||
IIL | Input leakage current | –16 | 16 | nA | ||
PSRR | Power-supply rejection ratio | AVDD = 5.5 V | 75 | dB | ||
SAMPLING DYNAMICS | ||||||
tCONV | Conversion time per ADC | Half-clock mode | 17.5 | tCLK | ||
Full-clock mode | 35 | |||||
tACQ | Acquisition time | Half-clock mode | 2 | tCLK | ||
Full-clock Mode | 4 | |||||
fDATA | Data rate | 25 | 1000 | kSPS | ||
tA | Aperture delay | 6 | ns | |||
tA match | ADC to ADC | 50 | ps | |||
tAJIT | Aperture jitter | 50 | ps | |||
fCLK | Clock frequency | Half-clock mode | 0.5 | 20 | MHz | |
Full-clock mode | 1 | 40 | ||||
tCLK | Clock period | Half-clock mode | 50 | 2000 | ns | |
Full-clock mode | 25 | 1000 | ||||
INTERNAL VOLTAGE REFERENCE | ||||||
Resolution | Reference output DAC resolution | 10 | Bits | |||
VREFOUT | Reference output voltage | Over 20% to 100% DAC range | 0.2VREFOUT | VREFOUT | V | |
REFIO1, DAC = 3FFh | 2.485 | 2.500 | 2.515 | |||
REFIO2, DAC = 3FFh | 2.480 | 2.500 | 2.520 | |||
dVREFOUT/dT | Reference voltage drift | ±10 | ppm/°C | |||
DNLDAC | DAC differential linearity error | –4 | ±1 | 4 | LSB | |
INLDAC | DAC integral linearity error | –4 | ±0.5 | 4 | LSB | |
VOSDAC | DAC offset error | VREFOUT = 0.5 V | –4 | ±1 | 4 | LSB |
PSRR | Power-supply rejection ratio | 73 | dB | |||
IREFOUT | Reference output dc current | –2 | +2 | mA | ||
IREFSC | Reference output short-circuit current(1) | 50 | mA | |||
tREFON | Reference output settling time | CREF = 22 μF | 8 | ms | ||
VOLTAGE REFERENCE INPUT | ||||||
VREF | Reference input voltage range | 0.5 | 2.5 | 2.525 | V | |
IREF | Reference input current | 50 | μA | |||
CREF | External ceramic reference capacitance | 22 | μF | |||
DIGITAL INPUTS(2) | ||||||
IIN | Input current | VIN = DVDD to DGND | –50 | +50 | nA | |
CIN | Input capacitance | 5 | pF | |||
Logic family | CMOS with Schmitt-Trigger | |||||
VIH | High-level input voltage | DVDD = 4.5 V to 5.5 V | 0.7DVDD | DVDD + 0.3 | V | |
VIL | Low-level input voltage | DVDD = 4.5 V to 5.5 V | –0.3 | 0.3DVDD | V | |
Logic family | LVCMOS | |||||
VIH | High-level input voltage | DVDD = 2.3 V to 3.6 V | 2 | DVDD + 0.3 | V | |
VIL | Low-level input voltage | DVDD = 2.3 V to 3.6 V | –0.3 | 0.8 | V | |
DIGITAL OUTPUTS(2) | ||||||
COUT | Output capacitance | 5 | pF | |||
CLOAD | Load capacitance | 30 | pF | |||
Logic family | CMOS | |||||
VOH | High-level output voltage | DVDD = 4.5 V, IOH = –100 µA | 4.44 | V | ||
VOL | Low-level output voltage | DVDD = 4.5 V, IOH = +100 µA | 0.5 | V | ||
Logic family | LVCMOS | |||||
VOH | High-level output voltage | DVDD = 2.3 V, IOH = –100 µA | DVDD – 0.2 | V | ||
VOL | Low-level output voltage | DVDD = 2.3 V, IOH = +100 µA | 0.2 | V | ||
POWER SUPPLY | ||||||
AVDD | Analog supply voltage | AVDD to AGND, half-clock mode | 2.7 | 5.0 | 5.5 | V |
AVDD to AGND, full-clock mode | 4.5 | 5.0 | 5.5 | |||
DVDD | Digital supply voltage | 3-V and 3.3-V levels | 2.3 | 2.5 | 3.6 | V |
5-V levels, half-clock mode only | 4.5 | 5.0 | 5.5 | |||
AIDD | Analog supply current | AVDD = 3.6 V | 12.0 | 16.0 | mA | |
AVDD = 5.5 V | 15.0 | 20.0 | ||||
AVDD = 3.6 V, sleep and auto-sleep modes | 0.8 | 1.2 | ||||
AVDD = 5.5 V, sleep and auto-sleep modes | 0.9 | 1.4 | ||||
Power-down mode | 0.005 | |||||
DIDD | Digital supply current | DVDD = 3.6 V, CLOAD = 10 pF | 1.1 | 2.5 | mA | |
DVDD = 5.5 V, CLOAD = 10 pF | 3 | 6 | ||||
PD | Power dissipation (normal operation) | AVDD = DVDD = 3.6 V | 47.2 | 66.6 | mW | |
AVDD = 5.5 V, DVDD = 3.6 V | 86.5 | 117.0 |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
tDATA | Data throughput, fCLK = max | 1 | μs | ||
tCONV | Conversion time | Half-clock mode | 17.5 | tCLK | |
Full-clock mode | 35 | ||||
tACQ | Acquisition time | 100 | ns | ||
fCLK | CLOCK frequency | Half-clock mode | 0.5 | 20 | MHz |
Full-clock mode | 1 | 40 | |||
tCLK | CLOCK period | Half-clock mode | 50 | 2000 | ns |
Full-clock mode | 25 | 1000 | |||
tCLKL | CLOCK low time | 11.25 | ns | ||
tCLKH | CLOCK high time | 11.25 | ns | ||
t1 | CONVST rising edge to first CLOCK rising edge | 12 | ns | ||
t2 | CONVST high time | 10 | ns | ||
Half-clock mode: timing modes II and IV only | 1 | tCLK | |||
t3 | RD high time, half-clock mode: timing modes II, IV, SII, and SIV only | 1 | tCLK | ||
tS1 | RD high to CLOCK falling edge setup time | 5 | ns | ||
tH1 | RD high to CLOCK falling edge hold time | 5 | ns | ||
tS2 | Input data to CLOCK falling edge setup time | 5 | ns | ||
tH2 | Input data to CLOCK falling edge hold time | 4 | ns | ||
tD1 | CONVST rising edge to BUSY high delay(2) | 2.3 V < DVDD < 3.6 V | 19 | ns | |
4.5 V < DVDD < 5.5 V | 16 | ||||
tD2 | CLOCK 18th falling edge (half-clock mode) or 24th rising edge (full-clock mode) to BUSY low delay | 2.3 V < DVDD < 3.6 V | 25 | ns | |
4.5 V < DVDD < 5.5 V | 20 | ||||
tD3 | CLOCK rising edge to next data valid delay | Half-clock mode, 2.3 V < DVDD < 3.6 V |
14 | ns | |
Half-clock mode, 4.5 V < DVDD < 5.5 V |
12 | ||||
tH3 | Output data to CLOCK rising edge hold time, half-clock mode | 3 | ns | ||
tD4 | CLOCK falling edge to next data valid delay, full-clock mode | 19 | ns | ||
tH4 | Output data to CLOCK falling edge hold time, full-clock mode | 7 | ns | ||
tD5 | RD falling edge to first data valid | 2.3 V < DVDD < 3.6 V | 16 | ns | |
4.5 V < DVDD < 5.5 V | 12 | ||||
tD6 | CS rising edge to SDOx 3-state | 6 | ns |