JAJSLP3 june   2023 AFE43902-Q1 , AFE53902-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: ADC Input
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements: I2C Standard Mode
    9. 6.9  Timing Requirements: I2C Fast Mode
    10. 6.10 Timing Requirements: I2C Fast Mode Plus
    11. 6.11 Timing Requirements: SPI Write Operation
    12. 6.12 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    14. 6.14 Timing Requirements: PWM Output
    15. 6.15 Timing Diagrams
    16. 6.16 Typical Characteristics: Voltage Output
    17. 6.17 Typical Characteristics: ADC
    18. 6.18 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Analog Front End (AFE) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check (CRC)
          1. 7.3.3.1.1 NVM-CRC-FAIL-USER Bit
          2. 7.3.3.1.2 NVM-CRC-FAIL-INT Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 External Reset
      6. 7.3.6 Register-Map Lock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital-to-Analog Converter (DAC) Mode
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
          1. 7.4.1.1.1 Power-Supply as Reference
          2. 7.4.1.1.2 Internal Reference
          3. 7.4.1.1.3 External Reference
      2. 7.4.2 Pulse-Width Modulation (PWM) Mode
      3. 7.4.3 Analog-to-Digital Converter (ADC) Mode
      4. 7.4.4 Multislope Thermal Foldback Mode
        1. 7.4.4.1 Thermistor Linearization
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-x-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0400h]
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh) [reset = 03F9h]
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  COMMON-PWM-TRIG Register (address = 21h) [reset = 0001h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 2068h]
      7. 7.6.7  DEVICE-MODE-CONFIG Register (address = 25h) [reset = 8040h]
      8. 7.6.8  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      9. 7.6.9  STATE-MACHINE-CONFIG0 Register (address = 27h) [reset = 0003h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      12. 7.6.12 Xx-TEMPERATURE Register (SRAM address = 20h, 22h, 24h) [reset = 0000h]
      13. 7.6.13 Yx-TEMPERATURE Register (SRAM address = 21h, 23h, 25h) [reset = 0000h]
      14. 7.6.14 Xx-OUTPUT Register (SRAM address = 26h, 28h, 2Ah, 2Ch) [reset = 0000h]
      15. 7.6.15 Yx-OUTPUT Register (SRAM address = 27h, 29h, 2Bh, 2Dh) [reset = 0000h]
      16. 7.6.16 PWM-FREQUENCY Register (SRAM address = 2Eh) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Multislope Thermal Foldback Using the AFE53902-Q1 and Voltage Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Multislope Thermal Foldback Using the AFE43902-Q1 and PWM Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.6.6 GENERAL-STATUS Register (address = 22h) [reset = 2068h]

Figure 7-19 GENERAL-STATUS Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
NVM-CRC-FAIL-INT NVM-CRC-FAIL-USER X DAC-0-BUSY X DAC-1-BUSY NVM-BUSY DEVICE-ID VERSION-ID
R-0h R-0h X-1h R-0h X-0h R-0h R-0h AFE53902-Q1: R-10h
AFE43902-Q1: R-11h		 R-0h
Table 7-19 GENERAL-STATUS Register Field Descriptions
Bit Field Type Reset Description
15 NVM-CRC-FAIL-INT R 0 0: No CRC error in OTP.
1: Indicates a failure in OTP loading. A software reset or power-cycle brings the device out of this condition in case of temporary failure.
14 NVM-CRC-FAIL-USER R 0 0: No CRC error in NVM loading.
1: Indicates a failure in NVM loading. The register settings are corrupted. The device allows all operations during this error condition. Reprogram the NVM to get the original state. A software reset brings the device out of this error condition.
13 X X 1 Don't care.
12 DAC-0-BUSY R 0 0: DAC-0 channel accepts commands.
1: DAC-0 channel does not accept commands.
11-10 X X 0 Don't care.
9 DAC-1-BUSY R 0 0: DAC-1 channel accepts commands.
1: DAC-1 channel does not accept commands.
8 NVM-BUSY R 0 0: NVM is available for read and write.
1: NVM is not available for read or write.
7-2 DEVICE-ID R AFE53902-Q1: 10h
AFE43902-Q1: 11h		 Device identifier.
1-0 VERSION-ID R 00 Version identifier.