JAJSKN9A november   2020  – march 2023 ALM2403-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overtemperature and Shutdown Pin (OTF/SH_DN)
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Current-Limit and Short-Circuit Protection
      4. 7.3.4 Input Common-Mode Range
      5. 7.3.5 Reverse Body Diodes in Output-Stage Transistors
      6. 7.3.6 EMI Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open-Loop and Closed-Loop Operation
      2. 7.4.2 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resolver Excitation Amplifier Combined With MFB 2nd-Order, Low-Pass Filter
          1. 8.2.2.1.1 Filter Design
          2. 8.2.2.1.2 Short-to-Battery Protection
        2. 8.2.2.2 Power Dissipation and Thermal Reliability
          1. 8.2.2.2.1 Improving Package Thermal Performance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) ALM2403-Q1 UNIT
PWP (HTSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 46.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.1 °C/W
RθJB Junction-to-board thermal resistance 22.6 °C/W
ψJT Junction-to-top characterization parameter 1.2 °C/W
ψJB Junction-to-board characterization parameter 22.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.