JAJSQX4G october   1980  – august 2023 AM26LS32AC , AM26LS32AM , AM26LS33AM

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1.     17
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1.      23
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) AM26LS3xAC, AM26LS32AI AM26LS32AC UNIT
D (SOIC) DR (SOIC-Reel) N (PDIP) NR (PDIP-Reel) NS (SO) NSR (SO-Reel) PW (TSSOP) PWR (TSSOP-Reel)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 75.7 84.6 45.3 60.6 75.8 88.5 102.7 107.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35 43.5 32.7 48.1 32.9 46.2 37.8 38.4 °C/W
RθJB Junction-to-board thermal resistance 33.3 43.2 25.3 40.6 36.6 50.7 47.7 53.7 °C/W
ψJT Junction-to-top characterization parameter 6.6 10.4 17.8 27.5 6 13.5 3 3.2 °C/W
ψJB Junction-to-board characterization parameter 33 42.8 25.1 40.3 36.3 50.3 47.1 53.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.