SPRSPA3A
March 2024 – September 2024
AM67
,
AM67A
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
3.1
Functional Block Diagram
4
Device Comparison
5
Terminal Configuration and Functions
5.1
Pin Diagrams
5.2
Pin Attributes
10
11
5.3
Signal Descriptions
13
5.3.1
CPSW3G
5.3.1.1
MAIN Domain
16
17
18
19
5.3.2
CPTS
5.3.2.1
MAIN Domain
22
5.3.3
CSI-2
5.3.3.1
MAIN Domain
25
26
27
28
5.3.4
DDRSS
5.3.4.1
MAIN Domain
31
5.3.5
DSI
5.3.5.1
MAIN Domain
34
5.3.6
DSS
5.3.6.1
MAIN Domain
37
5.3.7
ECAP
5.3.7.1
MAIN Domain
40
41
42
5.3.8
Emulation and Debug
5.3.8.1
MAIN Domain
45
5.3.8.2
MCU Domain
47
5.3.9
EPWM
5.3.9.1
MAIN Domain
50
51
52
53
5.3.10
EQEP
5.3.10.1
MAIN Domain
56
57
58
5.3.11
GPIO
5.3.11.1
MAIN Domain
61
62
5.3.11.2
MCU Domain
64
5.3.12
GPMC
5.3.12.1
MAIN Domain
67
5.3.13
I2C
5.3.13.1
MAIN Domain
70
71
72
73
74
5.3.13.2
MCU Domain
76
5.3.13.3
WKUP Domain
78
5.3.14
MCAN
5.3.14.1
MAIN Domain
81
82
5.3.14.2
MCU Domain
84
85
5.3.15
MCASP
5.3.15.1
MAIN Domain
88
89
90
91
92
5.3.16
MCSPI
5.3.16.1
MAIN Domain
95
96
97
5.3.16.2
MCU Domain
99
100
5.3.17
MDIO
5.3.17.1
MAIN Domain
103
5.3.18
MMC
5.3.18.1
MAIN Domain
106
107
108
5.3.19
OLDI
5.3.19.1
MAIN Domain
111
5.3.20
OSPI
5.3.20.1
MAIN Domain
114
5.3.21
Power Supply
116
5.3.22
Reserved
118
5.3.23
SERDES
5.3.23.1
MAIN Domain
121
122
123
5.3.24
System and Miscellaneous
5.3.24.1
Boot Mode Configuration
5.3.24.1.1
MAIN Domain
127
5.3.24.2
Clock
5.3.24.2.1
MCU Domain
130
5.3.24.2.2
WKUP Domain
132
5.3.24.3
System
5.3.24.3.1
MAIN Domain
135
5.3.24.3.2
MCU Domain
137
5.3.24.3.3
WKUP Domain
139
5.3.24.4
VMON
141
5.3.25
TIMER
5.3.25.1
MAIN Domain
144
5.3.25.2
MCU Domain
146
5.3.25.3
WKUP Domain
148
5.3.26
UART
5.3.26.1
MAIN Domain
151
152
153
154
155
156
157
5.3.26.2
MCU Domain
159
5.3.26.3
WKUP Domain
161
5.3.27
USB
5.3.27.1
MAIN Domain
164
165
5.4
Pin Connectivity Requirements
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings for Devices which are not AEC - Q100 Qualified
6.3
Power-On Hours (POH)
6.4
Recommended Operating Conditions
6.5
Operating Performance Points
6.6
Electrical Characteristics
6.6.1
I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
6.6.2
Fail-Safe Reset (FS RESET) Electrical Characteristics
6.6.3
High-Frequency Oscillator (HFOSC) Electrical Characteristics
6.6.4
Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
6.6.5
SDIO Electrical Characteristics
6.6.6
LVCMOS Electrical Characteristics
6.6.7
CSI-2 (D-PHY) Electrical Characteristics
6.6.8
USB2PHY Electrical Characteristics
6.6.9
DDR Electrical Characteristics
6.7
VPP Specifications for One-Time Programmable (OTP) eFuses
6.7.1
Recommended Operating Conditions for OTP eFuse Programming
6.7.2
Hardware Requirements
6.7.3
Programming Sequence
6.7.4
Impact to Your Hardware Warranty
6.8
Thermal Resistance Characteristics
6.8.1
Thermal Resistance Characteristics for AMW Package TBD
6.9
Timing and Switching Characteristics
6.9.1
Timing Parameters and Information
6.9.2
Power Supply Requirements
6.9.2.1
Power Supply Slew Rate Requirement
6.9.2.2
Power Supply Sequencing
6.9.2.2.1
Power-Up Sequencing
6.9.2.2.2
Power-Down Sequencing
6.9.2.2.3
Partial IO Power Sequencing
6.9.3
System Timing
6.9.3.1
Reset Timing
6.9.3.2
Error Signal Timing
6.9.3.3
Clock Timing
6.9.4
Clock Specifications
6.9.4.1
Input Clocks / Oscillators
6.9.4.1.1
MCU_OSC0 Internal Oscillator Clock Source
6.9.4.1.1.1
Load Capacitance
6.9.4.1.1.2
Shunt Capacitance
6.9.4.1.2
MCU_OSC0 LVCMOS Digital Clock Source
6.9.4.1.3
WKUP_LFOSC0 Internal Oscillator Clock Source
6.9.4.1.4
WKUP_LFOSC0 LVCMOS Digital Clock Source
6.9.4.1.5
WKUP_LFOSC0 Not Used
6.9.4.2
Output Clocks
6.9.4.3
PLLs
6.9.4.4
Recommended System Precautions for Clock and Control Signal Transitions
6.9.5
Peripherals
6.9.5.1
ATL
6.9.5.1.1
ATL_PCLK Timing Requirements
6.9.5.1.2
ATL_AWS[x] Timing Requirements
6.9.5.1.3
ATL_BWS[x] Timing Requirements
6.9.5.1.4
ATCLK[x] Switching Characteristics
6.9.5.2
CPSW3G
6.9.5.2.1
CPSW3G MDIO Timing
6.9.5.2.2
CPSW3G RMII Timing
6.9.5.2.3
CPSW3G RGMII Timing
6.9.5.3
CPTS
6.9.5.4
CSI-2
6.9.5.5
CSI-2 TX
6.9.5.6
DDRSS
6.9.5.7
DSS
6.9.5.8
ECAP
6.9.5.9
Emulation and Debug
6.9.5.9.1
Trace
6.9.5.9.2
JTAG
6.9.5.10
EPWM
6.9.5.11
EQEP
6.9.5.12
GPIO
6.9.5.13
GPMC
6.9.5.13.1
GPMC and NOR Flash — Synchronous Mode
6.9.5.13.2
GPMC and NOR Flash — Asynchronous Mode
6.9.5.13.3
GPMC and NAND Flash — Asynchronous Mode
6.9.5.14
I2C
6.9.5.15
MCAN
6.9.5.16
MCASP
6.9.5.17
MCSPI
6.9.5.17.1
MCSPI — Controller Mode
6.9.5.17.2
MCSPI — Peripheral Mode
6.9.5.18
MMCSD
6.9.5.18.1
MMC0 - eMMC Interface
6.9.5.18.1.1
Legacy SDR Mode
6.9.5.18.1.2
High Speed SDR Mode
6.9.5.18.1.3
High Speed DDR Mode
6.9.5.18.1.4
HS200 Mode
6.9.5.18.1.5
HS400 Mode
6.9.5.18.1.6
UHS–I SDR12 Mode
6.9.5.18.1.7
UHS–I SDR25 Mode
6.9.5.18.1.8
UHS–I SDR50 Mode
6.9.5.18.1.9
UHS–I DDR50 Mode
6.9.5.18.1.10
UHS–I SDR104 Mode
6.9.5.18.2
MMC1/MMC2 - SD/SDIO Interface
6.9.5.18.2.1
Default Speed Mode
6.9.5.18.2.2
High Speed Mode
6.9.5.18.2.3
UHS–I SDR12 Mode
6.9.5.18.2.4
UHS–I SDR25 Mode
6.9.5.18.2.5
UHS–I SDR50 Mode
6.9.5.18.2.6
UHS–I DDR50 Mode
6.9.5.18.2.7
UHS–I SDR104 Mode
6.9.5.19
OSPI
6.9.5.19.1
OSPI0 PHY Mode
6.9.5.19.1.1
OSPI0 With PHY Data Training
6.9.5.19.1.2
OSPI0 Without Data Training
6.9.5.19.1.2.1
OSPI0 PHY SDR Timing
6.9.5.19.1.2.2
OSPI0 PHY DDR Timing
6.9.5.19.2
OSPI0 Tap Mode
6.9.5.19.2.1
OSPI0 Tap SDR Timing
6.9.5.19.2.2
OSPI0 Tap DDR Timing
6.9.5.20
PCIe
6.9.5.21
Timers
6.9.5.22
UART
6.9.5.23
USB
7
Detailed Description
7.1
Overview
8
Applications, Implementation, and Layout
8.1
Device Connection and Layout Fundamentals
8.1.1
Power Supply
8.1.1.1
Power Distribution Network Implementation Guidance
8.1.2
External Oscillator
8.1.3
JTAG, EMU, and TRACE
8.1.4
Unused Pins
8.2
Peripheral- and Interface-Specific Design Information
8.2.1
LPDDR4 Board Design and Layout Guidelines
8.2.2
OSPI/QSPI/SPI Board Design and Layout Guidelines
8.2.2.1
No Loopback, Internal PHY Loopback, and Internal Pad Loopback
8.2.2.2
External Board Loopback
8.2.2.3
DQS (only available in Octal SPI devices)
8.2.3
USB VBUS Design Guidelines
8.2.4
System Power Supply Monitor Design Guidelines
8.2.5
High Speed Differential Signal Routing Guidance
8.2.6
Thermal Solution Guidance
8.3
Clock Routing Guidelines
8.3.1
Oscillator Routing
9
Device and Documentation Support
9.1
Device Nomenclature
9.1.1
Standard Package Symbolization
9.1.2
Device Naming Convention
9.2
Tools and Software
9.3
Documentation Support
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Packaging Information
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ(パッケージ|ピン)
AMW|594
サーマルパッド・メカニカル・データ
発注情報
sprspa3a_oa
5.3.14
MCAN