JAJSIJ4B June   2020  – September 2024 AMC3330-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
      4. 6.3.4 Isolated DC/DC Converter
      5. 6.3.5 Diagnostic Output and Fail-Safe Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filter Design
        2. 7.2.2.2 Differential to Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) AMC3330-Q1 UNIT
DWE (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 73.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31 °C/W
RθJB Junction-to-board thermal resistance 44 °C/W
ψJT Junction-to-top characterization parameter 16.7 °C/W
ψJB Junction-to-board characterization parameter 42.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.