SLAS836 March   2014 AMC7832

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Power Amp Biasing Diagram
  5. 5 Revision History
  6. 6 Terminal Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements - Serial Interface
    7. 7.7  Typical Characteristics: DAC
    8. 7.8  Typical Characteristics: ADC
    9. 7.9  Typical Characteristics: Reference
    10. 7.10 Typical Characteristics: Temperature Sensor
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converters (DACs)
        1. 8.3.1.1 DAC Output Range and Clamp Configuration
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 DAC Clear Operation
      2. 8.3.2 Analog-to-Digital Converter (ADC)
        1. 8.3.2.1 Analog Inputs
          1. 8.3.2.1.1 Bipolar Analog Inputs
          2. 8.3.2.1.2 Unipolar Analog Inputs
        2. 8.3.2.2 ADC Sequencing
        3. 8.3.2.3 ADC Synchronization
        4. 8.3.2.4 Programmable Out-of-Range Alarms
          1. 8.3.2.4.1 Unipolar Inputs Out-of-Range Alarms
          2. 8.3.2.4.2 Internal Temperature Sensor Out-of-Range Alarms
          3. 8.3.2.4.3 ALARMIN Alarm
          4. 8.3.2.4.4 Hysteresis
          5. 8.3.2.4.5 False-Alarm Protection
      3. 8.3.3 Internal Temperature Sensor
      4. 8.3.4 Internal Reference
      5. 8.3.5 General Purpose I/Os
    4. 8.4 Programming
    5. 8.5 Register Map
      1. 8.5.1  Interface Configuration: Address 0x00 - 0x02
      2. 8.5.2  Device Identification: Address 0x03 - 0x0D
      3. 8.5.3  Register Update (Buffered Registers): Address 0x0F
      4. 8.5.4  General Device Configuration: Address 0x10 - 0x17
      5. 8.5.5  DAC Clear And ALARMOUT Source Select: Address 0x1A - 0x1D
      6. 8.5.6  DAC Range: Address 0x1E
      7. 8.5.7  ADC Data: Address 0x20 - 0x41
      8. 8.5.8  DAC Data: Address 0x50 - 0x67
      9. 8.5.9  Status Registers: Address 0x70 - 0x72
      10. 8.5.10 Temperature And GPIO Data: Address 0x78 - 0x7A
      11. 8.5.11 Out-Of-Range ADC Thresholds: Address 0x80 - 0x93
      12. 8.5.12 Hysteresis: Address 0xA0 - 0xA5
      13. 8.5.13 Power-Down Registers: Address 0xB0 - 0xB3
      14. 8.5.14 ADC Trigger: Address 0xC0
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application Schematic
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 ADC Input Conditioning
        2. 9.2.3.2 DAC Output Range Selection
        3. 9.2.3.3 Temperature Sensing Applications
        4. 9.2.3.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.