JAJSHW6A september   2019  – august 2023 BQ21061

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Linear Charger and Power Path
        1. 7.3.1.1 Battery Charging Process
        2. 7.3.1.2 JEITA and Battery Temperature Dependent Charging
        3. 7.3.1.3 Input Voltage Based Dynamic Power Management (VINDPM) and Dynamic Power Path Management (DPPM)
        4. 7.3.1.4 Battery Supplement Mode
      2. 7.3.2  Protection Mechanisms
        1. 7.3.2.1 Input Over-Voltage Protection
        2. 7.3.2.2 Safety Timer and I2C Watchdog Timer
        3. 7.3.2.3 Thermal Protection and Thermal Charge Current Foldback
        4. 7.3.2.4 Battery Short and Over Current Protection
        5. 7.3.2.5 PMID Short Circuit
      3. 7.3.3  VDD LDO
      4. 7.3.4  Load Switch/LDO Output and Control
      5. 7.3.5  PMID Power Control
      6. 7.3.6  System Voltage (PMID) Regulation
      7. 7.3.7  MR Wake and Reset Input
        1. 7.3.7.1 MR Wake or Short Button Press Functions
        2. 7.3.7.2 MR Reset or Long Button Press Functions
      8. 7.3.8  14-Second Watchdog for HW Reset
      9. 7.3.9  Faults Conditions and Interrupts ( INT)
        1. 7.3.9.1 Flags and Fault Condition Response
      10. 7.3.10 Power Good ( PG) Pin
      11. 7.3.11 External NTC Monitoring (TS)
        1. 7.3.11.1 TS Thresholds
      12. 7.3.12 I2C Interface
        1. 7.3.12.1 F/S Mode Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
      2. 7.4.2 Low Power
      3. 7.4.3 Active Battery
      4. 7.4.4 Charger/Adapter Mode
      5. 7.4.5 Power-Up/Down Sequencing
    5. 7.5 Register Map
      1. 7.5.1 I2C Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input (IN/PMID) Capacitors
        2. 8.2.2.2 VDD, LDO Input and Output Capacitors
        3. 8.2.2.3 TS
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 サード・パーティ製品に関する免責事項
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Trademarks
    7. 11.7 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)BQ21061UNIT
YFP (DSBGA)
20-PIN
RθJAJunction-to-ambient thermal resistance (2)36.1°C/W
RθJAJunction-to-ambient thermal resistance74.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.5°C/W
RθJBJunction-to-board thermal resistance17.6°C/W
ΨJTJunction-to-top characterization parameter0.3°C/W
ΨJBJunction-to-board characterization parameter17.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured in BQ21061EVM board.