JAJSBP7N September   2008  – October 2021 BQ24072 , BQ24073 , BQ24074 , BQ24075 , BQ24079

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings (1)
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Power On
      3. 9.3.3 Overvoltage Protection (OVP)
      4. 9.3.4 Dynamic Power Path Management
        1. 9.3.4.1 Input Source Connected (ADAPTER or USB)
          1. 9.3.4.1.1 Input DPM Mode (VIN-DPM)
          2. 9.3.4.1.2 DPPM Mode
          3. 9.3.4.1.3 Battery Supplement Mode
        2. 9.3.4.2 Input Source Not Connected
      5. 9.3.5 Battery Charging
        1. 9.3.5.1 Charge Current Translator
        2. 9.3.5.2 Adjustable Termination Threshold (ITERM Input, BQ24074)
        3. 9.3.5.3 Termination Disable (TD Input, BQ24072, BQ24073)
        4. 9.3.5.4 Battery Detection and Recharge
        5. 9.3.5.5 Battery Disconnect (SYSOFF Input, BQ24075, BQ24079)
        6. 9.3.5.6 Dynamic Charge Timers (TMR Input)
        7. 9.3.5.7 Status Indicators ( PGOOD, CHG)
        8. 9.3.5.8 Thermal Regulation and Thermal Shutdown
      6. 9.3.6 Battery Pack Temperature Monitoring
    4. 9.4 Device Functional Modes
      1. 9.4.1 Sleep Mode
      2. 9.4.2 Explanation of Deglitch Times and Comparator Hysteresis
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 BQ2407x Charger Design Example
          1. 10.2.2.1.1 Termination Disable (TD) (BQ24072, BQ24073 only)
          2. 10.2.2.1.2 System ON/OFF (SYSOFF) (BQ24075 or BQ24079 only)
        2. 10.2.2.2 Calculations
          1. 10.2.2.2.1 Program the Fast Charge Current (ISET):
          2. 10.2.2.2.2 Program the Input Current Limit (ILIM)
          3. 10.2.2.2.3 Program the Termination Current Threshold (ITERM) (BQ24074 only)
          4. 10.2.2.2.4 Program 6.25-hour Fast-Charge Safety Timer (TMR)
        3. 10.2.2.3 TS Function
        4. 10.2.2.4 CHG and PGOOD
        5. 10.2.2.5 Selecting IN, OUT, and BAT Pin Capacitors
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Standalone Charger
      2. 10.3.2 Disconnecting the Battery From the System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1 Layout Guidelines

  • To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2407x, with short trace runs to both IN, OUT and GND (thermal pad).
  • All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
  • The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces
  • The BQ2407x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full PCB design guidelines for this package are provided in the QFN/SON PCB Attachment Application Note.