SLUSF69 May   2024 BQ25186

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Pre-Charge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control (SYS_MODE bit control)
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  Input Current Limit (ILIM)
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1 Input Overvoltage Protection
        2. 7.3.8.2 Battery Undervoltage Lockout
        3. 7.3.8.3 Battery Overcurrent Protection
        4. 7.3.8.4 System Overvoltage Protection
        5. 7.3.8.5 System Short Protection
        6. 7.3.8.6 Thermal Protection and Thermal Regulation
        7. 7.3.8.7 Safety Timer and Watchdog Timer
      9. 7.3.9  Pushbutton Wake and Reset Input
        1. 7.3.9.1 Pushbutton Wake or Short Button Press Functions
        2. 7.3.9.2 Pushbutton Reset or Long Button Press Functions
      10. 7.3.10 Hardware Reset
      11. 7.3.11 Software Reset
      12. 7.3.12 Interrupt Indicator (/INT) Pin
        1. 7.3.12.1 Interrupt Indicator (/INT) Pin
      13. 7.3.13 Power Good (PG) / General Purpose Output Pin
      14. 7.3.14 External NTC Monitoring (TS)
        1. 7.3.14.1 TS Biasing and Function
      15. 7.3.15 I2C Interface
        1. 7.3.15.1 F/S Mode Protocol
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 I2C Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input (IN/SYS) Capacitors
        2. 8.2.2.2 TS
        3. 8.2.2.3 Recommended Passive Components
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DLH|10
サーマルパッド・メカニカル・データ
発注情報

6.3 Thermal Information

THERMAL METRIC(1) BQ25185 UNIT
DLH
10
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 68.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.2 °C/W
RθJB Junction-to-board thermal resistance 34.7 °C/W
ΨJT Junction-to-top characterization parameter 2.0 °C/W
ΨJB Junction-to-board characterization parameter 34.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.