JAJSVS3 October   2024 BQ25190

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 概要 (続き)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Precharge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  ILIM Control
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1  Input Overvoltage Protection
        2. 7.3.8.2  System Short Protection
        3. 7.3.8.3  Battery Depletion Protection
          1. 7.3.8.3.1 Battery Undervoltage Lockout
        4. 7.3.8.4  Battery Overcurrent Protection
        5. 7.3.8.5  Safety Timer and Watchdog Timer
        6. 7.3.8.6  Buck Overcurrent Protection
        7. 7.3.8.7  LDO Overcurrent Protection
        8. 7.3.8.8  Buck-Boost Overcurrent Protection
        9. 7.3.8.9  Buck-Boost Output Short-Circuit Protection
        10. 7.3.8.10 Buck/Buck-Boost/LDO Undervoltage Lockout
        11. 7.3.8.11 Sequence Undervoltage Lockout
        12. 7.3.8.12 Thermal Protection and Thermal Regulation
      9. 7.3.9  Integrated 12-Bit ADC for Monitoring
        1. 7.3.9.1 ADC Programmable Comparators
      10. 7.3.10 Pushbutton Wake and Reset Input
        1. 7.3.10.1 Pushbutton Short Button Press or Wake Functions
        2. 7.3.10.2 Pushbutton Long Button Press Functions
      11. 7.3.11 VIN Pulse Detection for Hardware Reset
      12. 7.3.12 15-Second VIN Watchdog for Hardware Reset
      13. 7.3.13 Hardware Reset
      14. 7.3.14 Software Reset
      15. 7.3.15 Interrupt to Host (INT)
      16. 7.3.16 External NTC Monitoring (TS)
        1. 7.3.16.1 TS Thresholds
      17. 7.3.17 Power Rail Power Sequence
        1. 7.3.17.1 Power-Up Sequence
        2. 7.3.17.2 Power-Down Sequence
      18. 7.3.18 Integrated Buck Converter (Buck)
      19. 7.3.19 Integrated Buck-Boost Converter (Buck-boost)
      20. 7.3.20 Integrated LDOs (LDO1/LDO2)
      21. 7.3.21 Multi-Function GPIOs
        1. 7.3.21.1 GPIO1 Functions
        2. 7.3.21.2 GPIO2 Functions
        3. 7.3.21.3 GPIO3 Functions
        4. 7.3.21.4 GPIO4 Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
        1. 7.4.1.1 LDO1-ON Ship Mode
      2. 7.4.2 Battery Mode
      3. 7.4.3 Adapter Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Byte Format
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.5.1.5 Target Address and Data Direction Bit
        6. 7.5.1.6 Single Write and Read
        7. 7.5.1.7 Multi-Write and Multi-Read
    6. 7.6 Register Maps
      1. 7.6.1 BQ25190 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Performance Plots
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 サード・パーティ製品に関する免責事項
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • YBG|30
サーマルパッド・メカニカル・データ
発注情報

6.6 Timing Requirements

MIN NOM MAX UNIT
INPUT
tVIN_OVPZ_DGL VIN_OVP deglitch, VIN falling 30 ms
tSLEEP_DGL Deglitch time to enter sleep mode, VIN falling 64 µs
BATTERY CHARGER
tREC_SC BAT_OCP retry hiccup time 250 ms
tRETRY_SC Retry window for BAT_OCP 2 s
tBATDEPL Deglitch time to open the BATFET when VBAT < VBATDEPL  260 µs
tTSHUT_DGLZ TSHUT recovery deglitch time 100 ms
POWER SEQUENCING
tSEQ_DELAY Delay time between power sequence time instances, SEQUENCE_DELAY_TIME = b00 1 ms
Delay time between power sequence time instances, SEQUENCE_DELAY_TIME = b01 4 ms
Delay time between power sequence time instances, SEQUENCE_DELAY_TIME = b10 16 ms
Delay time between power sequence time instances, SEQUENCE_DELAY_TIME = b11 64 ms
tSEQ_PG_DELAY Delay time from time instance d to power sequence power good being evaluated  4 ms
I2C CLOCK
FI2C_CLK SCL clock frequency 1000 KHz