JAJSKU7C September   2022  – February 2024 BQ25620 , BQ25622

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 概要 (続き)
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power-On-Reset (POR)
      2. 8.3.2  Device Power Up from Battery
      3. 8.3.3  Device Power Up from Input Source
        1. 8.3.3.1 REGN LDO Power Up
        2. 8.3.3.2 Poor Source Qualification
        3. 8.3.3.3 D+/D– Detection Sets Input Current Limit (BQ25620 Only)
        4. 8.3.3.4 ILIM Pin (BQ25622 Only)
        5. 8.3.3.5 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        6. 8.3.3.6 Converter Power-Up
      4. 8.3.4  Power Path Management
        1. 8.3.4.1 Narrow VDC Architecture
        2. 8.3.4.2 Dynamic Power Management
        3. 8.3.4.3 High Impedance Mode
      5. 8.3.5  Battery Charging Management
        1. 8.3.5.1 Autonomous Charging Cycle
        2. 8.3.5.2 Battery Charging Profile
        3. 8.3.5.3 Charging Termination
        4. 8.3.5.4 Thermistor Qualification
          1. 8.3.5.4.1 Advanced Temperature Profile in Charge Mode
          2. 8.3.5.4.2 TS Pin Thermistor Configuration
          3. 8.3.5.4.3 Cold/Hot Temperature Window in OTG Mode
          4. 8.3.5.4.4 JEITA Charge Rate Scaling
          5. 8.3.5.4.5 TS_BIAS Pin (BQ25622 Only)
        5. 8.3.5.5 Charging Safety Timers
      6. 8.3.6  USB On-The-Go (OTG)
        1. 8.3.6.1 Boost OTG Mode
      7. 8.3.7  Integrated 12-Bit ADC for Monitoring
      8. 8.3.8  Status Outputs ( PG, STAT, INT)
        1. 8.3.8.1 PG Pin Power Good Indicator
        2. 8.3.8.2 Interrupts and Status, Flag and Mask Bits
        3. 8.3.8.3 Charging Status Indicator (STAT)
        4. 8.3.8.4 Interrupt to Host ( INT)
      9. 8.3.9  BATFET Control
        1. 8.3.9.1 Shutdown Mode
        2. 8.3.9.2 Ship Mode
        3. 8.3.9.3 System Power Reset
      10. 8.3.10 Protections
        1. 8.3.10.1 Voltage and Current Monitoring in Battery Only and HIZ Modes
          1. 8.3.10.1.1 Battery Undervoltage Lockout
          2. 8.3.10.1.2 Battery Overcurrent Protection
        2. 8.3.10.2 Voltage and Current Monitoring in Buck Mode
          1. 8.3.10.2.1 Input Overvoltage
          2. 8.3.10.2.2 System Overvoltage Protection (SYSOVP)
          3. 8.3.10.2.3 Forward Converter Cycle-by-Cycle Current Limit
          4. 8.3.10.2.4 System Short
          5. 8.3.10.2.5 Battery Overvoltage Protection (BATOVP)
          6. 8.3.10.2.6 Sleep and Poor Source Comparators
        3. 8.3.10.3 Voltage and Current Monitoring in Boost Mode
          1. 8.3.10.3.1 Boost Mode Overvoltage Protection
          2. 8.3.10.3.2 Boost Mode Duty Cycle Protection
          3. 8.3.10.3.3 Boost Mode PMID Undervoltage Protection
          4. 8.3.10.3.4 Boost Mode Battery Undervoltage
          5. 8.3.10.3.5 Boost Converter Cycle-by-Cycle Current Limit
          6. 8.3.10.3.6 Boost Mode SYS Short
        4. 8.3.10.4 Thermal Regulation and Thermal Shutdown
          1. 8.3.10.4.1 Thermal Protection in Buck Mode
          2. 8.3.10.4.2 Thermal Protection in Boost Mode
          3. 8.3.10.4.3 Thermal Protection in Battery-Only Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
      2. 8.4.2 Register Bit Reset
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 START and STOP Conditions
        3. 8.5.1.3 Byte Format
        4. 8.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.5.1.5 Target Address and Data Direction Bit
        6. 8.5.1.6 Single Write and Read
        7. 8.5.1.7 Multi-Write and Multi-Read
    6. 8.6 Register Maps
      1. 8.6.1 Register Programming
      2. 8.6.2 BQ25620 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) BQ25620, BQ25622 UNIT
RYK (QFN)
18 pins
RθJA Junction-to-ambient thermal resistance 60.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.1 °C/W
RθJB Junction-to-board thermal resistance 13.0 °C/W
ΨJT Junction-to-top characterization parameter 1.3 °C/W
ΨJB Junction-to-board characterization parameter 12.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.