JAJSQP6B December   2022  – March 2024 BQ25758

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Power-On-Reset
      2. 6.3.2 Device Power-Up From Battery Without Input Source
      3. 6.3.3 Device Power Up from Input Source
        1. 6.3.3.1 VAC Operating Window Programming (ACUV and ACOV)
        2. 6.3.3.2 MODE Pin Configuration
        3. 6.3.3.3 REGN Regulator (REGN LDO)
        4. 6.3.3.4 Compensation-Free Buck-Boost Converter Operation
          1. 6.3.3.4.1 Light-Load Operation
        5. 6.3.3.5 Switching Frequency and Synchronization (FSW_SYNC)
        6. 6.3.3.6 Device HIZ Mode
      4. 6.3.4 Power Management
        1. 6.3.4.1 Output Voltage Programming (VOUT_REG)
        2. 6.3.4.2 Output Current Programming (IOUT pin and IOUT_REG)
        3. 6.3.4.3 Dynamic Power Management: Input Voltage and Input Current Regulation
          1. 6.3.4.3.1 Input Current Regulation
            1. 6.3.4.3.1.1 IIN Pin
          2. 6.3.4.3.2 Input Voltage Regulation
        4. 6.3.4.4 Bypass Mode
      5. 6.3.5 Bidirectional Power Flow and Programmability
      6. 6.3.6 Integrated 16-Bit ADC for Monitoring
      7. 6.3.7 Status Outputs (PG, STAT and INT)
        1. 6.3.7.1 Power Good Indicator (PG)
        2. 6.3.7.2 Interrupt to Host (INT)
      8. 6.3.8 Protections
        1. 6.3.8.1 Voltage and Current Monitoring
          1. 6.3.8.1.1 VAC Over-voltage Protection (VAC_OVP)
          2. 6.3.8.1.2 VAC Under-voltage Protection (VAC_UVP)
          3. 6.3.8.1.3 Reverse Mode Over-voltage Protection (REV_OVP)
          4. 6.3.8.1.4 Reverse Mode Under-voltage Protection (REV_UVP)
          5. 6.3.8.1.5 DRV_SUP Under-voltage and Over-voltage Protection (DRV_OKZ)
          6. 6.3.8.1.6 REGN Under-voltage Protection (REGN_OKZ)
        2. 6.3.8.2 Thermal Shutdown (TSHUT)
      9. 6.3.9 Serial Interface
        1. 6.3.9.1 Data Validity
        2. 6.3.9.2 START and STOP Conditions
        3. 6.3.9.3 Byte Format
        4. 6.3.9.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 6.3.9.5 Target Address and Data Direction Bit
        6. 6.3.9.6 Single Write and Read
        7. 6.3.9.7 Multi-Write and Multi-Read
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host Mode and Default Mode
      2. 6.4.2 Register Bit Reset
    5. 6.5 BQ25758 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Application (Buck-Boost configuration)
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
          2. 7.2.1.2.2 Switching Frequency Selection
          3. 7.2.1.2.3 Inductor Selection
          4. 7.2.1.2.4 Input (VAC) Capacitor
          5. 7.2.1.2.5 Output (VBAT) Capacitor
          6. 7.2.1.2.6 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
          7. 7.2.1.2.7 Converter Fast Transient Response
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application (Buck-only configuration)
        1. 7.2.2.1 Design Requirements
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 サード・パーティ製品に関する免責事項
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1 Layout Guidelines

Proper layout of the components to minimize high frequency current path loops is important to prevent electrical and magnetic field radiation and high frequency resonant problems. Here is a PCB layout priority list for proper layout.

Table 9-1 PCB Layout Guidelines
COMPONENTS FUNCTION IMPACT GUIDELINES
Buck high side FET, Buck low side FET, input capacitors Buck input loop High frequency noise, ripple, efficiency This path forms a high frequency switching loop due to the pulsating current at the input of the buck. Place components on the same side of the board. Minimize loop area to reduce parasitic inductance. Maximize trace width to reduce parasitic resistance. Place input ceramic capacitors close to the switching FETs.
Boost low side FET, boost high side FET, output capacitors Boost output loop High frequency noise, ripple, efficiency This path forms a high frequency switching loop due to the pulsating current at the output of the boost. Place components on the same side of the board. Minimize loop area to reduce parasitic inductance. Maximize trace width to reduce parasitic resistance. Place output ceramic capacitors close to the switching FETs.
Sense resistors, switching FETs, inductor Current path Efficiency The current path from input to output through the power stage and sense resistors has low impedance. Pay attention to via resistance if they are not on the same side. The number of vias can be estimated as 1- to 2-A per via for a 10-mil via with 1 oz. copper thickness.
Switching FETs, inductor Power stage Thermal, efficiency The switching FETs and inductor are the components with highest power loss. Allow enough copper area for heat dissipation. Multiple thermal vias can be used to connect more copper layers together and dissipate more heat.
DRV_SUP, BTST1, BTST2 capacitors Switching FET gate drive High frequency noise, parasitic ringing, gate drive integrity The DRV_SUP capacitor is used to supply the power to drive the low side FETs. The BTST capacitors are used to drive the high side FETs. It is recommended to place the capacitors as close as possible to the IC.
LODRV1, LODRV2 Low side gate drive High frequency noise, parasitic ringing, gate drive integrity LODRV1 and LODRV2 supplies the gate drive current to turn on the low side FETs. The return of LODRV1 and LODRV2 is PGND. As current take the path of least impedance, a ground plane close to the low side gate drive traces is recommended. Minimize gate drive length and aim for at least 20-mil gate drive trace width.
HIDRV1, HIDRV2, SW1 (pin trace), SW2 (pin trace) High side gate drive High frequency noise, parasitic ringing, gate drive integrity HIDRV1 and HIDRV2 supplies the gate drive current to turn on the high side FETs. The return of HIDRV1 and HIDRV2 are SW1 and SW2, respectively. Route HIDRV1/SW1 and HIDRV2/SW2 pair next to each other to reduce gate drive parasitic inductance. Minimize gate drive length and aim for at least 20-mil gate drive trace width.
Current limit resistors, FSW_SYNC resistor IC programmable settings Regulation accuracy, switching integrity Pin voltage determines the settings for input current limit, output current limit and switching frequency. Ground noise on these could lead to inacuracy. Minimize ground return from these resistors to the IC ground pin.
Input (ACP, ACN) and output (SRP, SRN) current sense Current regulation Regulation accuracy Use Kelvin-sensing technique for input and output current sense resistors. Connect the current sense traces to the center of the pads, and run current sense traces as differential pairs, away from switching nodes.
Input (ACUV), and output (FB, VO_SNS) voltage sensing Voltage sense and regulation Regulation accuracy ACUV divider sets internal input voltage regulation in forward mode (VACUV_DPM). Route the top of the divider point to the target regulation location. VO_SNS sets the output voltage regulation in forward mode (VOUT_REG_ACC). Route directly to the target regulation location. Avoid routing close to high power switching nodes.
Bypass capacitors Noise filter Noise immunity Place lowest value capacitors closest to the IC.