JAJSL52A april 2020 – february 2021 BQ25968
PRODUCTION DATA
THERMAL METRIC | BQ25968 | UNIT | |
---|---|---|---|
YFF (DSBGA) | |||
56 PIN | |||
RθJA | Junction-to-ambient thermal resistance | 47.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 10.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 0.2 | °C/W |
ωJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ωJB | Junction-to-board characterization parameter | 10.4 | °C/W |