SWRS108B May   2011  – June 2014 CC113L

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
      1. 4.5.1 Typical RX Current Consumption over Temperature and Input Power Level, 868/915 MHz
    6. 4.6  RF Receive Section
      1. 4.6.1 Typical Sensitivity over Temperature and Supply Voltage, 868 MHz, Sensitivity Optimized Setting
      2. 4.6.2 Typical Sensitivity over Temperature and Supply Voltage, 915 MHz, Sensitivity Optimized Setting
      3. 4.6.3 Blocking and Selectivity
    7. 4.7  Crystal Oscillator
    8. 4.8  Frequency Synthesizer Characteristics
    9. 4.9  DC Characteristics
    10. 4.10 Power-On Reset
    11. 4.11 Thermal Characteristics
    12. 4.12 Typical Characteristics
      1. 4.12.1 Typical Characteristics, RX Current Consumption
      2. 4.12.2 Typical Characteristics, Blocking and Selectivity
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
      1. 5.5.1 Chip Status Byte
      2. 5.5.2 Register Access
      3. 5.5.3 SPI Read
      4. 5.5.4 Command Strobes
      5. 5.5.5 RX FIFO Access
    6. 5.6  Microcontroller Interface and Pin Configuration
      1. 5.6.1 Configuration Interface
      2. 5.6.2 General Control and Status Pins
    7. 5.7  Data Rate Programming
    8. 5.8  Receiver Channel Filter Bandwidth
    9. 5.9  Demodulator, Symbol Synchronizer, and Data Decision
      1. 5.9.1 Frequency Offset Compensation
      2. 5.9.2 Bit Synchronization
      3. 5.9.3 Byte Synchronization
    10. 5.10 Packet Handling Hardware Support
      1. 5.10.1 Packet Format
        1. 5.10.1.1 Arbitrary Length Field Configuration
        2. 5.10.1.2 Packet Length > 255
      2. 5.10.2 Packet Filtering
        1. 5.10.2.1 Address Filtering
        2. 5.10.2.2 Maximum Length Filtering
        3. 5.10.2.3 CRC Filtering
      3. 5.10.3 Packet Handling in Receive Mode
      4. 5.10.4 Packet Handling in Firmware
    11. 5.11 Modulation Formats
      1. 5.11.1 Frequency Shift Keying
      2. 5.11.2 Amplitude Modulation
    12. 5.12 Received Signal Qualifiers and RSSI
      1. 5.12.1 Sync Word Qualifier
      2. 5.12.2 RSSI
      3. 5.12.3 Carrier Sense (CS)
        1. 5.12.3.1 CS Absolute Threshold
        2. 5.12.3.2 CS Relative Threshold
    13. 5.13 Radio Control
      1. 5.13.1 Power-On Start-Up Sequence
        1. 5.13.1.1 Automatic POR
        2. 5.13.1.2 Manual Reset
      2. 5.13.2 Crystal Control
      3. 5.13.3 Voltage Regulator Control
      4. 5.13.4 Receive Mode (RX)
      5. 5.13.5 RX Termination
      6. 5.13.6 Timing
        1. 5.13.6.1 Overall State Transition Times
        2. 5.13.6.2 Frequency Synthesizer Calibration Time
    14. 5.14 RX FIFO
    15. 5.15 Frequency Programming
    16. 5.16 VCO
      1. 5.16.1 VCO and PLL Self-Calibration
    17. 5.17 Voltage Regulators
    18. 5.18 General Purpose and Test Output Control Pins
    19. 5.19 Asynchronous and Synchronous Serial Operation
      1. 5.19.1 Asynchronous Serial Operation
      2. 5.19.2 Synchronous Serial Operation
    20. 5.20 System Consideration and Guidelines
      1. 5.20.1 SRD Regulations
      2. 5.20.2 Calibration in Multi-Channel Systems
    21. 5.21 Configuration Registers
      1. 5.21.1 Configuration Register Details - Registers with preserved values in SLEEP state
      2. 5.21.2 Configuration Register Details - Registers that Loose Programming in SLEEP State
      3. 5.21.3 Status Register Details
    22. 5.22 Development Kit Ordering Information
  6. 6Applications, Implementation, and Layout
    1. 6.1 Bias Resistor
    2. 6.2 Balun and RF Matching
      1. 6.2.1 Balun and RF Matching (Low-Cost Application Circuit)
      2. 6.2.2 Balun and RF Matching (Characterization Circuit)
    3. 6.3 Crystal
    4. 6.4 Reference Signal
    5. 6.5 Power Supply Decoupling
    6. 6.6 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation from Texas Instruments
      2. 7.2.2 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
    7. 7.7 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Device and Documentation Support

7.1 Device Support

7.1.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC113L). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGP) and the temperature range (for example, blank is the default commercial temperature range).

For orderable part numbers of CC113L devices in the QFN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

7.2.1 Related Documentation from Texas Instruments

The following documents describe the CC113L receiver. Copies of these documents are available on the Internet at www.ti.com.

    SWRR046Characterization Design 315 - 433 MHz (Identical to the CC1101EM 315 - 433 MHz Reference Design)
    SWRR045Characterization Design 868 - 915 MHz (Identical to the CC1101EM 868 - 915 MHz Reference Design)
    SWRA147DN010 Close-in Reception with CC1101
    SWRA159DN015 Permanent Frequency Offset Compensation
    SWRA114DN505 RSSI Interpretation and Timing
    SWRA215DN022 CC11xx OOK/ASK register settings
    SWRA122DN005 CC11xx Sensitivity versus Frequency Offset and Crystal Accuracy
    SWRR083CC113LEM 433 MHz Reference Design
    SWRR084CC113LEM 868 - 915 MHz Reference Design

7.2.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

7.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.5 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.

7.7 Additional Acronyms

Additional acronyms used in this data sheet are described below.

    2-FSKBinary Frequency Shift Keying
    4-FSK Quaternary Frequency Shift Keying
    ADCAnalog to Digital Converter
    AFC Automatic Frequency Compensation
    AGC Automatic Gain Control
    AMR Automatic Meter Reading
    BERBit Error Rate
    BTBandwidth-Time product
    CFR Code of Federal Regulations
    CRC Cyclic Redundancy Check
    CS Carrier Sense
    DCDirect Current
    DVGA Digital Variable Gain Amplifier
    ESR Equivalent Series Resistance
    FCC Federal Communications Commission
    FIFO First-In-First-Out
    FSFrequency Synthesizer
    GFSK Gaussian shaped Frequency Shift Keying
    IFIntermediate Frequency
    I/Q In-Phase/Quadrature
    ISMIndustrial, Scientific, Medical
    LCInductor-Capacitor
    LNALow Noise Amplifier
    LO Local Oscillator
    LSB Least Significant Bit
    MCUMicrocontroller Unit
    MSBMost Significant Bit
    N/A Not Applicable
    NRZNon Return to Zero (Coding)
    OOKOn-Off Keying
    PAPower Amplifier
    PCBPrinted Circuit Board
    PDPower Down
    PER Packet Error Rate
    PLLPhase Locked Loop
    POR Power-On Reset
    PTATProportional To Absolute Temperature
    QLPQuad Leadless Package
    QPSKQuadrature Phase Shift Keying
    RC Resistor-Capacitor
    RFRadio Frequency
    RSSIReceived Signal Strength Indicator
    RXReceive, Receive Mode
    SMDSurface Mount Device
    SPISerial Peripheral Interface
    SRDShort Range Devices
    VCOVoltage Controlled Oscillator
    XOSCCrystal Oscillator
    XTALCrystal