SWRS178C February   2015  – July 2016 CC2620

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RSM Package
    4. 4.4 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    7. 5.7  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 5.12 ADC Characteristics
    13. 5.13 Temperature Sensor
    14. 5.14 Battery Monitor
    15. 5.15 Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17 Programmable Current Source
    18. 5.18 Synchronous Serial Interface (SSI)
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Resistance Characteristics
    21. 5.21 Timing Requirements
    22. 5.22 Switching Characteristics
    23. 5.23 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.2.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Community Resources
    7. 8.7  Additional Information
    8. 8.8  Trademarks
    9. 8.9  Electrostatic Discharge Caution
    10. 8.10 Export Control Notice
    11. 8.11 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

2 Revision History

Changes from January 20, 2016 to July 5, 2016

  • Added split VDDS supply rail feature Go
  • Added option for up to 80-Ω ESR when CL is 6 pF or lower Go
  • Added tolerance for RCOSC_LF and RTC accuracy content Go
  • Added Figure 5-21, Supply Current vs Temperature Go

Changes from December 2, 2015 to January 19, 2016

  • Updated the Soc ADC internal voltage reference specification in Section 5.12 Go
  • Moved all SSI parameters to Section 5.18 Go
  • Added 0-dBm setting to the TX Current Consumption vs Supply Voltage (VDDS) graph Go
  • Changed Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS) Go
  • Changed the errata listed in Section 8.3Go

Changes from February 22, 2015 to December 2, 2015

  • Removed RHB package option from CC2620Go
  • Added motional inductance recommendation to the 24-MHz XOSC table Go
  • Added SPI timing parameters Go
  • Added VOH and VOL min and max values for 4-mA and 8-mA load Go
  • Added min and max values for VIH and VIL Go
  • Added IEEE 802.15.4 Sensitivity vs Channel FrequencyGo
  • Added RF Output Power vs Channel FrequencyGo
  • Added Figure 5-11, Receive Mode Current vs Supply Voltage (VDDS)Go
  • Changed Figure 5-20, SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10)Go
  • Clarified Brown Out Detector status and functionality in the Power Modes table. Go
  • Added application circuit schematics and layout for 5XD and 4XS Go