JAJSOV7C december   2020  – july 2023 CC2662R-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  Receive (RX)
    10. 8.10 Transmit (TX)
    11. 8.11 Timing and Switching Characteristics
      1. 8.11.1 Reset Timing
      2. 8.11.2 Wakeup Timing
      3. 8.11.3 Clock Specifications
        1. 8.11.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.11.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.11.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.11.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.11.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.11.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.11.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       34
      5. 8.11.5 UART
        1. 8.11.5.1 UART Characteristics
    12. 8.12 Peripheral Characteristics
      1. 8.12.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.12.2 DAC
        1. 8.12.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.12.3 Temperature and Battery Monitor
        1. 8.12.3.1 Temperature Sensor
        2. 8.12.3.2 Battery Monitor
      4. 8.12.4 Comparators
        1. 8.12.4.1 Continuous Time Comparator
        2. 8.12.4.2 Low-Power Clocked Comparator
      5. 8.12.5 Current Source
        1. 8.12.5.1 Programmable Current Source
      6. 8.12.6 GPIO
        1. 8.12.6.1 GPIO DC Characteristics
    13. 8.13 Typical Characteristics
      1. 8.13.1 MCU Current
      2. 8.13.2 RX Current
      3. 8.13.3 TX Current
      4. 8.13.4 RX Performance
      5. 8.13.5 TX Performance
      6. 8.13.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.8 Thermal Resistance Characteristics

THERMAL METRIC(1) PACKAGE UNIT
RGZ
(VQFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 24.2 °C/W(2)
RθJC(top) Junction-to-case (top) thermal resistance 13.6 °C/W(2)
RθJB Junction-to-board thermal resistance 7.8 °C/W(2)
ψJT Junction-to-top characterization parameter 0.1 °C/W(2)
ψJB Junction-to-board characterization parameter 7.7 °C/W(2)
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W(2)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.