JAJSHT5D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 機能ブロック図
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 8.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Export Control Notice
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

11.4.5 Package Placement

Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm. Component pick and place systems are composed of a vision system that recognizes and positions the component and a mechanical system that physically performs the pick and place operation. Two commonly used types of vision systems are:

  • A vision system that locates a package silhouette
  • A vision system that locates individual pads on the interconnect pattern

The second type renders more accurate placements but tends to be more expensive and time consuming. Both methods are acceptable since the parts align due to a self-centering features fo the solder joint during solder reflow. It is recommended to release the package to 1 to 2 mils into the solder paste or with minimum force to avoid causing any possible damage to the thinner packages.