SWAS032F July   2013  – February 2015 CC3200

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes and Pin Multiplexing
      1. 3.1.1 Connections for Unused Pins
      2. 3.1.2 Recommended Pin Multiplexing Configurations
    2. 3.2 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    3. 3.3 Pad State After Application of Power To Chip But Prior To Reset Release
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Power-On Hours
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Brown-Out and Black-Out
    6. 4.6  Electrical Characteristics (3.3 V, 25°C)
    7. 4.7  WLAN Receiver Characteristics
    8. 4.8  WLAN Transmitter Characteristics
    9. 4.9  Current Consumption
    10. 4.10 Thermal Characteristics for RGC Package
    11. 4.11 Timing and Switching Characteristics
      1. 4.11.1 Power Supply Sequencing
      2. 4.11.2 Reset Timing
        1. 4.11.2.1 nRESET (32K XTAL)
        2. 4.11.2.2 nRESET (External 32K)
        3. 4.11.2.3 Wakeup from Hibernate
      3. 4.11.3 Clock Specifications
        1. 4.11.3.1 Slow Clock Using Internal Oscillator
        2. 4.11.3.2 Slow Clock Using an External Clock
        3. 4.11.3.3 Fast Clock (Fref) Using an External Crystal
        4. 4.11.3.4 Fast Clock (Fref) Using an External Oscillator
        5. 4.11.3.5 Input Clocks/Oscillators
        6. 4.11.3.6 WLAN Filter Requirements
      4. 4.11.4 Peripherals
        1. 4.11.4.1 SPI
          1. 4.11.4.1.1 SPI Master
          2. 4.11.4.1.2 SPI Slave
        2. 4.11.4.2 McASP
          1. 4.11.4.2.1 I2S Transmit Mode
          2. 4.11.4.2.2 I2S Receive Mode
        3. 4.11.4.3 GPIO
          1. 4.11.4.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
          2. 4.11.4.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.8 V)
          3. 4.11.4.3.3 GPIO Input Transition Time Parameters
        4. 4.11.4.4 I2C
        5. 4.11.4.5 IEEE 1149.1 JTAG
        6. 4.11.4.6 ADC
        7. 4.11.4.7 Camera Parallel Port
        8. 4.11.4.8 UART
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Device Features
    2. 5.2 Functional Block Diagram
    3. 5.3 ARM Cortex-M4 Processor Core Subsystem
    4. 5.4 CC3200 Device Encryption
    5. 5.5 Wi-Fi Network Processor Subsystem
    6. 5.6 Power-Management Subsystem
      1. 5.6.1 VBAT Wide-Voltage Connection
      2. 5.6.2 Preregulated 1.85 V
    7. 5.7 Low-Power Operating Mode
    8. 5.8 Memory
      1. 5.8.1 External Memory Requirements
      2. 5.8.2 Internal Memory
        1. 5.8.2.1 SRAM
        2. 5.8.2.2 ROM
        3. 5.8.2.3 Memory Map
    9. 5.9 Boot Modes
      1. 5.9.1 Overview
      2. 5.9.2 Invocation Sequence/Boot Mode Selection
      3. 5.9.3 Boot Mode List
  6. 6Applications and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Typical Application - CC3200 Wide-Voltage Mode
      2. 6.1.2 Typical Application - CC3200 Preregulated 1.85-V Mode
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 PinMux Tool
        2. 7.1.1.2 Radio Tool
        3. 7.1.1.3 Uniflash Flash Programmer
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

2 Revision History

Changes from E Revision (August 2014) to F Revision

  • Added Wi-Fi CERTIFIEDGo
  • Added application throughput in Section 1.1, FeaturesGo
  • Changed LPDS drain value from 120 µA in Section 1.1, FeaturesGo
  • Changed idle connected from 695 µA in Section 1.1, FeaturesGo
  • Added note defining X in part number in Device Information tableGo
  • Changed part number in Device Information table from CC3200Go
  • Changed SDCARD signal names for pins 6, 7, 8, and 64 in Table 3-1Go
  • Changed use of pin 61 from no in Table 3-1Go
  • Added note in Section 4.4, Recommended Operating Conditions, on avoiding the PA auto-protect featureGo
  • Added Table 4-1Go
  • Added note in Section 4.6, Electrical Characteristics (3.3 V, 25°C), on proper device resetGo
  • Changed "current" to "active current" in note 7 of Section 4.9, Current ConsumptionGo
  • Changed Figure 4-8 to reflect T2, T3, and T4 measurementsGo
  • Changed Table 4-4 to reflect T2, T3, and T4 timing items Go
  • Added note in Table 4-4 about extending wake-up time in Hibernate modeGo
  • Changed frequency accuracy from ±20 ppm in Table 4-5Go
  • Added Section 4.11.3.6, WLAN Filter RequirementsGo
  • Deleted I3 (tLP) and I4 (tHP) from Table 4-10Go
  • Deleted I3 (tLP) and I4 (tHP) from Table 4-11Go
  • Changed TCP of throughput in Table 5-1 item 17 from 12 Mbps Go
  • Changed part number of item 17 from CC3200R1-M2RTDR in Table 6-1Go
  • Added note following Table 6-1Go
  • Changed part number of item 16 from CC3200R1-M2RTDR in Table 6-2Go
  • Added note following Table 6-2Go