JAJSJB0K August   1998  – June 2020 CD4049UB , CD4050B

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 説明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: DC
    6. 6.6 Electrical Characteristics: AC
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • PW|16
  • NS|16
  • N|16
  • DW|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)CD4049UBCD4050BUNIT
D
(SOIC)
DW
(SOIC)
E
(PDIP)
NS
(SO)
PW
(TSSOP)
D
(SOIC)
DW
(SOIC)
E
(PDIP)
NS
(SO)
PW
(TSSOP)
16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance(2)81.681.649.584.3108.981.681.249.783.8108.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance41.544.536.84343.741.544.13742.543.2°C/W
RθJBJunction-to-board thermal resistance3946.329.444.6543945.929.644.153.5°C/W
ψJTJunction-to-top characterization parameter10.716.521.712.84.610.716.121.912.54.5°C/W
ψJBJunction-to-board characterization parameter38.745.829.344.353.438.745.429.543.852.9°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
The package thermal impedance is calculated in accordance with JESD 51-7.