JAJSNS7E January   1998  – October 2022 CD54HC540 , CD54HC541 , CD54HCT541 , CD74HC540 , CD74HC541 , CD74HCT540 , CD74HCT541

PRODUCTION DATA  

  1. 1 特長
  2. 2 概要
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • J|20
サーマルパッド・メカニカル・データ
発注情報

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
IIK Input diode current For VI < –0.5 V or VI > VCC + 0.5 V ±20 mA
IOK Output diode current For VO < –0.5 V or VO > VCC + 0.5 V ±20 mA
IO Drain current, per output For –0.5 V < VO < VCC + 0.5 V ±35 mA
IO Output source or sink current per output pin For VO > –0.5 V or VO < VCC + 0.5 V ±25 mA
Continuous current through VCC or ground current ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature range – 65 150 °C
Lead temperature (Soldering 10s) (SOIC - Lead Tips Only) 300 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.