JAJSG05G November   2009  – November 2022 CDC3RL02

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Additive Noise
      2. 8.3.2 Regulated 1.8-V Externally Available I/O Supply
      3. 8.3.3 Ultra-Small 8-bump YFP 0.4-mm Pitch WCSP Package
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Clock Squarer
      2. 9.1.2 Output Stage
      3. 9.1.3 LDO
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3 Recommended Operating Conditions

See (1)
MINMAXUNIT
VBATTInput voltage to internal LDO2.35.5V
VIInput voltageMCLK_IN, CLK_REQ1/201.89V
VOOutput voltageCLK_OUT1/201.8V
VIHHigh-level input voltageCLK_REQ1/21.31.89V
VILLow-level input voltageCLK_REQ1/200.5V
IOHHigh-level output current, DC current–8mA
IOLLow-level output current, DC current8mA
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.