4 Revision History
Changes from A Revision (June 2014) to B Revision
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Added the Receiving Notification of Documentation Updates and Community Resources sections to Device and Documentation Support. Go
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Changed the dimension between pads 3 and 4 from 0.028 inches: to 0.050 inches in the Recommended PCB Pattern section diagram Go
Changes from * Revision (December 2013) to A Revision
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Added small reel option to ordering information table. Go
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Increased silicon limit for continuous drain current to 157 A. Go
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Increased max pulsed current to 400 A. Go
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Added max power rating when the case temperature is held to 25°C. Go
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Updated pulsed current conditions to specify duty cycle ≤ 1%, pulse duration ≤ 100 µs, and Max RθJC = 0.8ºC/W. Go
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Updated Figure 10. Go
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Updated mechanical drawing. Go