JAJSEY5 March 2018 CSD86336Q3D
PRODUCTION DATA.
THERMAL METRIC | MIN | MAX | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance (min Cu)(1) | 105
|
°C/W | |
RθJA | Junction-to-ambient thermal resistance (max Cu)(1)(2) | 55
|
°C/W | |
RθJC | Junction-to-case thermal resistance (top of package)(1) | 17
|
°C/W | |
RθJC | Junction-to-case thermal resistance (PGND pin)(1) | 3.2
|
°C/W |