SLPS599 February   2016 CSD95472Q5MC

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7Application Schematic
  8. 8Device and Documentation Support
    1. 8.1 Community Resources
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Recommended PCB Land Pattern
    3. 9.3 Recommended Stencil Opening

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DMC|12
サーマルパッド・メカニカル・データ
発注情報

8 Device and Documentation Support

8.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

8.2 Trademarks

NexFET, E2E are trademarks of Texas Instruments.

DualCool is a trademark of TI.

All other trademarks are the property of their respective owners.

8.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

8.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.