JAJSE78C August   2017  – January 2019 DAC60504 , DAC70504 , DAC80504

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ブロック概略図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital-to-Analog Converter (DAC)
        1. 9.3.1.1 DAC Transfer Function
        2. 9.3.1.2 Output Amplifiers
        3. 9.3.1.3 DAC Register Structure
          1. 9.3.1.3.1 DAC Register Synchronous and Asynchronous Updates
          2. 9.3.1.3.2 Broadcast DAC Register
      2. 9.3.2 Internal Reference
        1. 9.3.2.1 Reference Divider
        2. 9.3.2.2 Solder Heat Reflow
      3. 9.3.3 Device Reset Options
        1. 9.3.3.1 Power-on-Reset (POR)
        2. 9.3.3.2 Software Reset
    4. 9.4 Device Functional Modes
      1. 9.4.1 Stand-Alone Operation
      2. 9.4.2 Daisy-Chain Operation
      3. 9.4.3 Frame Error Checking
      4. 9.4.4 Power-Down Mode
    5. 9.5 Programming
    6. 9.6 Register Map
      1. 9.6.1 NOP Register (address = 0x00) [reset = 0x0000]
        1. Table 9. NOP Register Field Descriptions
      2. 9.6.2 DEVICE ID Register (address = 0x01) [reset = 0x---]
        1. Table 10. DEVICE ID Field Descriptions
      3. 9.6.3 SYNC Register (address = 0x2) [reset = 0xFF00]
        1. Table 11. SYNC Register Field Descriptions
      4. 9.6.4 CONFIG Register (address = 0x3) [reset = 0x0000]
        1. Table 12. CONFIG Register Field Descriptions
      5. 9.6.5 GAIN Register (address = 0x04) [reset = 0x---]
        1. Table 13. GAIN Register Field Descriptions
      6. 9.6.6 TRIGGER Register (address = 0x05) [reset = 0x0000]
        1. Table 14. TRIGGER Register Field Descriptions
      7. 9.6.7 BRDCAST Register (address = 0x6) [reset = 0x0000]
        1. Table 15. BRDCAST Register Field Descriptions
      8. 9.6.8 STATUS Register (address = 0x7) [reset = 0x0000]
        1. Table 16. STATUS Register Field Descriptions
      9. 9.6.9 DACx Register (address = 0x8 to 0xF) [reset = 0x0000 or 0x8000]
        1. Table 17. DACx Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Interfacing to a Microcontroller
      2. 10.1.2 Programmable Current Source Circuit
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 関連リンク
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) DACx0504 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 33.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.5 °C/W
RθJB Junction-to-board thermal resistance 7.3 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 7.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.