REF |
1 |
C1 |
I/O |
When using internal reference, this is the reference output voltage pin (default). When using an external reference, this is the reference input pin to the device. |
OUT0 |
2 |
C2 |
O |
Analog output voltage from DAC 0. |
OUT1 |
3 |
B1 |
O |
Analog output voltage from DAC 1. |
OUT2 |
4 |
B2 |
O |
Analog output voltage from DAC 2. |
OUT3 |
5 |
A1 |
O |
Analog output voltage from DAC 3. |
GND |
6 |
A2 |
GND |
Ground reference point for all circuitry on the device. |
VDD |
7 |
A3 |
PWR |
Analog supply voltage (2.7 V to 5.5 V). |
OUT4 |
8 |
A4 |
O |
Analog output voltage from DAC 4. |
OUT5 |
9 |
B4 |
O |
Analog output voltage from DAC 5. |
OUT6 |
10 |
B3 |
O |
Analog output voltage from DAC 6. |
OUT7 |
11 |
C3 |
O |
Analog output voltage from DAC 7. |
CS |
12 |
C4 |
I |
Active low serial data enable. This input is the frame synchronization signal for the serial data. When the signal goes low, it enables the serial interface input shift register. |
SCLK |
13 |
D4 |
I |
Serial interface clock. |
SDI |
14 |
D3 |
I |
Serial interface data input. Data are clocked into the input shift register on each falling edge of the SCLK pin. |
SDO/ALARM |
15 |
D2 |
O |
DACx0508. Serial interface data output (default). The SDO pin is in high impedance when CS pin is high. Data are clocked out of the input shift register on either rising or falling edges of the SCLK pin as specified by the FSDO bit. Alternatively the pin can be configured as an ALARM open-drain output to indicate a CRC or reference alarm event. If configured as ALARM a 10 kΩ, pull-up resistor to VIO is required. |
CLR |
I |
DACx0508C. A low value on the CLR pin causes the DAC outputs of those channels configured for clear operation to update their registers and output to the reset value: zero scale (DACx0508Z) or midscale (DACx0508M). Bringing the CLR pin high causes the device to exit clear mode. |
VIO |
16 |
D1 |
PWR |
IO supply voltage (1.7 V to 5.5 V). This pin sets the I/O operating voltage for the serial interface. |
Thermal Pad |
– |
– |
– |
The thermal pad is located on the bottom-side of the WQFN package. The thermal pad should be connected to any internal PCB ground plane using multiple vias for good thermal performance. |