JAJSEF2D June   2013  – December 2021 DAC7760 , DAC8760

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: AC
    7. 7.7  Timing Requirements: Write Mode
    8. 7.8  Timing Requirements: Readback Mode
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  DAC Architecture
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Current Output Stage
      4. 8.3.4  Internal Reference
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  DAC Clear
      7. 8.3.7  Power-On Reset
      8. 8.3.8  Alarm Detection
      9. 8.3.9  Watchdog Timer
      10. 8.3.10 Frame Error Checking
      11. 8.3.11 User Calibration
      12. 8.3.12 Programmable Slew Rate
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Voltage and Current Output Ranges
      2. 8.4.2 Boost Configuration for IOUT
      3. 8.4.3 Filtering the Current Output (only on the VQFN package)
      4. 8.4.4 HART Interface
        1. 8.4.4.1 For 4-mA to 20-mA Mode
        2. 8.4.4.2 For All Current Output Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 SPI Shift Register
        2. 8.5.1.2 Write Operation
        3. 8.5.1.3 Read Operation
        4. 8.5.1.4 Stand-Alone Operation
        5. 8.5.1.5 Multiple Devices on the Bus
    6. 8.6 Register Maps
      1. 8.6.1 DACx760 Command and Register Map
        1. 8.6.1.1 DACx760 Register Descriptions
          1. 8.6.1.1.1 Control Register
          2. 8.6.1.1.2 Configuration Register
          3. 8.6.1.1.3 DAC Registers
          4. 8.6.1.1.4 Reset Register
          5. 8.6.1.1.5 Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Controlling the VOUT and IOUT Pins
        1. 9.1.1.1 VOUT and IOUT Pins are Independent Outputs, Never Simultaneously Enabled
        2. 9.1.1.2 VOUT and IOUT Pins are Independent Outputs, Simultaneously Enabled
        3. 9.1.1.3 VOUT and IOUT Pins are Tied Together, Never Simultaneously Enabled
      2. 9.1.2 Implementing HART in All Current Output Modes
        1. 9.1.2.1 Using CAP2 Pin on VQFN Package
        2. 9.1.2.2 Using the ISET-R Pin
      3. 9.1.3 Short-Circuit Current Limiting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±1500V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.