JAJSJ81C may   2020  – july 2023 DLP2010LC

PRODUCTION DATA  

1.   1
2. 1 特長
3. 2 アプリケーション
4. 3 概要
5. 4 Revision History
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Switching Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Physical Characteristics of the Micromirror Array
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Window Characteristics
   13. 6.13 Chipset Component Usage Specification
   14. 6.14 Software Requirements
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
   4. 7.4 Device Functional Modes
   5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
         1. 7.5.1.1 Numerical Aperture and Stray Light Control
         2. 7.5.1.2 Pupil Match
         3. 7.5.1.3 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Power Density Calculation
   8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On and Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1.      46
      2. 8.2.1 Design Requirements
      3. 8.2.2 Detailed Design Procedure
      4. 8.2.3 Application Curve
10. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
12. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 サード・パーティ製品に関する免責事項
       2. 11.1.2 Device Nomenclature
       3. 11.1.3 Device Markings
    2. 11.2 Related Links
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
13. 12Mechanical, Packaging, and Orderable Information