JAJSNF8 February   2022 DLP3020-Q1

PRODUCTION DATA  

1. 1 特長
2. 2 アプリケーション
3. 3 説明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Switching Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Physical Characteristics of the Micromirror Array
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Window Characteristics
   13. 6.13 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
         1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
   4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
   5. 7.5 DMD Image Performance Specification
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
   3. 8.3 Application Mission Profile Consideration
9. 9 Power Supply Recommendations
   1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Device Nomenclature
       2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
12. 12Mechanical, Packaging, and Orderable Information