JAJSOE1B
April 2019 – February 2023
DLP480RE
PRODUCTION DATA
1
特長
2
アプリケーション
3
概要
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Capacitance at Recommended Operating Conditions
6.8
Timing Requirements
6.9
System Mounting Interface Loads
6.10
Micromirror Array Physical Characteristics
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Optical Interface and System Image Quality
7.5.1.1
Numerical Aperture and Stray Light Control
7.5.1.2
Pupil Match
7.5.1.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
DMD Die Temperature Sensing
9
Power Supply Recommendations
9.1
DMD Power Supply Power-Up Procedure
9.2
DMD Power Supply Power-Down Procedure
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.2.1
Layers
10.2.2
Impedance Requirements
10.2.3
Trace Width, Spacing
10.2.3.1
Voltage Signals
11
Device and Documentation Support
11.1
サード・パーティ製品に関する免責事項
11.2
Device Support
11.2.1
Device Nomenclature
11.2.2
Device Markings
11.3
Documentation Support
11.3.1
Related Documentation
11.4
Receiving Notification of Documentation Updates
11.5
サポート・リソース
11.6
Trademarks
11.7
静電気放電に関する注意事項
11.8
用語集
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
FXG|257
MCSS005A
サーマルパッド・メカニカル・データ
発注情報
jajsoe1b_oa
11.2
Device Support