4 Revision History
Changes from Revision E (March 2017) to Revision F (April 2023)
- Changed Micromirror switching time typical value from 13 μs to 12.5
μs and removed 22 μs Max value. Go
Changes from Revision D (March 2017) to Revision E (March 2017)
- ウィンドウ透過率を変更Go
- マイクロミラーの反射率を変更Go
- アレイの回折効率を変更Go
- アレイの充填率を変更Go
- 高速なパターン・レートを変更Go
- Changed Recommended Operating Conditions table; split Environmental into 3 wavelength regions; simplified and reorganized the table footnotesGo
- Changed Thermal Metric textGo
- Changed Micromirror array optical efficiency Go
- Changed Micromirror array fill factor Go
- Changed Micromirror array diffraction efficiency Go
- Changed Micromirror surface reflectivity Go
- Changed Window transmission Go
- Changed Window transmittance, Minimum Go
- Changed Window transmittance, Average Go
- Changed Micromirror Array Temperature Calculation to indicate that it is based on lumensGo
- Added Micromirror Array Temperature Calculation based on powerGo
Changes from Revision C (September 2015) to Revision D (March 2017)
- Removed '692' from Pin Configurations imageGo
- Added RH name for relative humidity in
Section 6.1
Go
- Clarified TGRADIENT footnote in
Section 6.1
Go
- Changed Tstg to TDMD in
Section 6.2
to conform to current nomenclatureGo
- Changed typical micromirror crossover time to the time required to transition from mirror position to the other in
Section 6.12
Go
- Added typical micromirror switching time - 13 µs in
Section 6.12
Go
- Changed "Micromirror switching time" to "Array switching time" for clarity in
Section 6.12
Go
- Added clarification to Micromirror switching time at 400 MHz with global reset in
Section 6.12
Go
- Added "Digital Controller for Discovery 4100 chipset" to "DLPC410" headerGo
- Changed "Flash Configuration PROM" heading to "DLPR410 PROM for DLP Discovery 4100 chipset" Go
- Changed "DMD" heading to "DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMDGo
- Changed DLPC410, DLPR410, DLP9500 descriptions in Device Description section to match Feature Description sectionGo
- Updated Figure 11-1 and Figure 11-2
Go
- Added
Section 11.3
tableGo
Changes from Revision B (July 2013) to Revision C (October 2014)
- 「ESD 定格」表、「機能説明」セクション、「デバイスの機能モード」、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加。
Go
- 「特長」および「概要」セクションの表現を多少変更Go
- Changed the name of Micromirror clocking pulse reset in Pin FunctionsGo
- Changed ESD Ratings table to match new standardGo
- Added Max Recommended DMD Temperature – Derating CurveGo
- Moved Max Recommended DMD Temperature – Derating Curve to
Go
- Replaced
Figure 6-4
.Go
- Changed units from lbs to NGo
- Added explanation for the15 MBRST lines to the DLP9500 from each DLPA200Go
- Changed Thermal Test Point Location graphicGo
- Added program interface to system interface list in
Section 8.2.1
Go
- Corrected number of banks of DMD mirrors to 15 in
Section 8.2.1.1
Go
- Removed link to DLP Discovery 4100 chipset datasheetGo