JAJSFJ1 May   2018 DLPA4000

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      システム・ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Parameters
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Description
    3. 8.3 Feature Description
      1. 8.3.1 Supply and Monitoring
        1. 8.3.1.1 Supply
        2. 8.3.1.2 Monitoring
          1. 8.3.1.2.1 Block Faults
          2. 8.3.1.2.2 Low Battery and UVLO
          3. 8.3.1.2.3 Thermal Protection
      2. 8.3.2 Illumination
        1. 8.3.2.1 Programmable Gain Block
        2. 8.3.2.2 LDO Illumination
        3. 8.3.2.3 Illumination Driver A
        4. 8.3.2.4 External MOSFETs
          1. 8.3.2.4.1 Gate series resistor (RG)
          2. 8.3.2.4.2 Gate series diode (DG)
          3. 8.3.2.4.3 Gate parallel capacitance (CG)
        5. 8.3.2.5 RGB Strobe Decoder
          1. 8.3.2.5.1 Break Before Make (BBM)
          2. 8.3.2.5.2 Openloop Voltage
          3. 8.3.2.5.3 Transient Current Limit
        6. 8.3.2.6 Illumination Monitoring
          1. 8.3.2.6.1 Power Good
          2. 8.3.2.6.2 RatioMetric Overvoltage Protection
      3. 8.3.3 External Power MOSFET Selection
        1. 8.3.3.1 Threshold Voltage
        2. 8.3.3.2 Gate Charge and Gate Timing
        3. 8.3.3.3 On-resistance RDS(on)
      4. 8.3.4 DMD Supplies
        1. 8.3.4.1 LDO DMD
        2. 8.3.4.2 DMD HV Regulator
        3. 8.3.4.3 DMD/DLPC Buck Converters
        4. 8.3.4.4 DMD Monitoring
          1. 8.3.4.4.1 Power Good
          2. 8.3.4.4.2 Overvoltage Fault
      5. 8.3.5 Buck Converters
        1. 8.3.5.1 LDO Bucks
        2. 8.3.5.2 General Purpose Buck Converters
        3. 8.3.5.3 Buck Converter Monitoring
          1. 8.3.5.3.1 Power Good
          2. 8.3.5.3.2 Overvoltage Fault
      6. 8.3.6 Auxiliary LDOs
      7. 8.3.7 Measurement System
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 SPI
      2. 8.5.2 Interrupt
      3. 8.5.3 Fast-Shutdown in Case of Fault
      4. 8.5.4 Protected Registers
      5. 8.5.5 Writing to EEPROM
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Component Selection for General-Purpose Buck Converters
    3. 9.3 System Example With DLPA4000 Internal Block Diagram
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up and Power-Down Timing
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 LED Driver
        1. 11.1.1.1 PowerBlock Gate Control Isolation
        2. 11.1.1.2 VIN to PowerBlocks
        3. 11.1.1.3 Return Current from LEDs and RSense
        4. 11.1.1.4 RC Snubber
        5. 11.1.1.5 Capacitor Choice
      2. 11.1.2 General Purpose Buck 2
      3. 11.1.3 SPI Connections
      4. 11.1.4 RLIM Routing
      5. 11.1.5 LED Connection
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイスの項目表記
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

13.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
DLPA4000DPFD ACTIVE HTQFP PFD 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 DLPA4000
DLPA4000DPFDR ACTIVE HTQFP PFD 100 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 DLPA4000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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