JAJSFJ1
May 2018
DLPA4000
PRODUCTION DATA.
1
特長
2
アプリケーション
3
概要
Device Images
システム・ブロック図
4
改訂履歴
5
概要(続き)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
SPI Timing Parameters
8
Detailed Description
8.1
Overview
8.2
Functional Block Description
8.3
Feature Description
8.3.1
Supply and Monitoring
8.3.1.1
Supply
8.3.1.2
Monitoring
8.3.1.2.1
Block Faults
8.3.1.2.2
Low Battery and UVLO
8.3.1.2.3
Thermal Protection
8.3.2
Illumination
8.3.2.1
Programmable Gain Block
8.3.2.2
LDO Illumination
8.3.2.3
Illumination Driver A
8.3.2.4
External MOSFETs
8.3.2.4.1
Gate series resistor (RG)
8.3.2.4.2
Gate series diode (DG)
8.3.2.4.3
Gate parallel capacitance (CG)
8.3.2.5
RGB Strobe Decoder
8.3.2.5.1
Break Before Make (BBM)
8.3.2.5.2
Openloop Voltage
8.3.2.5.3
Transient Current Limit
8.3.2.6
Illumination Monitoring
8.3.2.6.1
Power Good
8.3.2.6.2
RatioMetric Overvoltage Protection
8.3.3
External Power MOSFET Selection
8.3.3.1
Threshold Voltage
8.3.3.2
Gate Charge and Gate Timing
8.3.3.3
On-resistance RDS(on)
8.3.4
DMD Supplies
8.3.4.1
LDO DMD
8.3.4.2
DMD HV Regulator
8.3.4.3
DMD/DLPC Buck Converters
8.3.4.4
DMD Monitoring
8.3.4.4.1
Power Good
8.3.4.4.2
Overvoltage Fault
8.3.5
Buck Converters
8.3.5.1
LDO Bucks
8.3.5.2
General Purpose Buck Converters
8.3.5.3
Buck Converter Monitoring
8.3.5.3.1
Power Good
8.3.5.3.2
Overvoltage Fault
8.3.6
Auxiliary LDOs
8.3.7
Measurement System
8.4
Device Functional Modes
8.5
Programming
8.5.1
SPI
8.5.2
Interrupt
8.5.3
Fast-Shutdown in Case of Fault
8.5.4
Protected Registers
8.5.5
Writing to EEPROM
8.6
Register Maps
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Component Selection for General-Purpose Buck Converters
9.3
System Example With DLPA4000 Internal Block Diagram
10
Power Supply Recommendations
10.1
Power-Up and Power-Down Timing
11
Layout
11.1
Layout Guidelines
11.1.1
LED Driver
11.1.1.1
PowerBlock Gate Control Isolation
11.1.1.2
VIN to PowerBlocks
11.1.1.3
Return Current from LEDs and RSense
11.1.1.4
RC Snubber
11.1.1.5
Capacitor Choice
11.1.2
General Purpose Buck 2
11.1.3
SPI Connections
11.1.4
RLIM Routing
11.1.5
LED Connection
11.2
Layout Example
11.3
Thermal Considerations
12
デバイスおよびドキュメントのサポート
12.1
デバイス・サポート
12.1.1
デバイスの項目表記
12.2
ドキュメントの更新通知を受け取る方法
12.3
コミュニティ・リソース
12.4
商標
12.5
静電気放電に関する注意事項
12.6
Glossary
13
メカニカル、パッケージ、および注文情報
13.1
Package Option Addendum
13.1.1
Packaging Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
PFD|100
MPQF054B
サーマルパッド・メカニカル・データ
PFD|100
PPTD321
発注情報
jajsfj1_oa
12.1.1
デバイスの項目表記
Figure 34.
パッケージ・マーキングDLPA4000 (上面図)