JAJSMH2A July   2021  – August 2021 DLPC1438

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 BT656 Interface General Timing Requirements
    15. 6.15 Flash Interface Timing Requirements
    16. 6.16 Other Timing Requirements
    17. 6.17 DMD Sub-LVDS Interface Switching Characteristics
    18. 6.18 DMD Parking Switching Characteristics
    19. 6.19 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 Parallel Interface
      2. 7.3.2 External Print
      3. 7.3.3 Device Startup
      4. 7.3.4 SPI Flash
        1. 7.3.4.1 SPI Flash Interface
        2. 7.3.4.2 SPI Flash Programming
      5. 7.3.5 I2C Interface
      6. 7.3.6 Test Point Support
      7. 7.3.7 DMD Interface
        1. 7.3.7.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Pattern projector for 3D printer without actuation and without FPGA
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Pattern projector for 3D printer with actuator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.1.2.1 Device Markings

GUID-DEE21ED3-60A2-4B05-A4FF-8C5A7E949344-low.gif

Marking Definitions:

Line 1:DLP® Device Name: DLPC1438 device name ID.
SC: Solder ball composition
   e1: Indicates lead-free solder balls consisting of SnAgCu
   G8: G indicates mold compound green; 8 indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with silver content less than or equal to 1.5% and that the mold compound meets TI's definition of green.
Line 2:TI Part Number
DLP® Device Name: DLPC1438 = x indicates 8 device name ID.
XXX corresponds to the device package designator.
Line 3:XXXXXXXXXX-TT Manufacturer part number
Line 4:Foundry lot code for semiconductor wafers and lead-free solder ball marking
YM: Year month date code
Z: Site code
LLL: Assembly lot code
S: Site code
May also be in the format LLLLLL.ZZZ
LLLLLL: Fab lot number
ZZZ: Lot split number
Line 5:PH YYWW: Package assembly information
PH: Manufacturing site
YYWW: Date code (YY = Year :: WW = Week)
Note:

  1. Engineering prototype samples are marked with an X suffix appended to the TI part number. For example, 2512737-0001X.