JAJSGN4F August   2012  – February 2019 DLPC410

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 Binary Pattern Data Path
        1. 8.3.1.1  DIN_A, DIN_B, DIN_C, DIN_D Input Data Buses
        2. 8.3.1.2  DCLKIN Input Clocks
        3. 8.3.1.3  DVALID Input Signals
        4. 8.3.1.4  DOUT_A, DOUT_B, DOUT_C, DOUT_D Output Data Buses
        5. 8.3.1.5  DCLKOUT Output Clocks
        6. 8.3.1.6  SCTRL Output Signals
        7. 8.3.1.7  Supported DMD Bus Sizes
        8. 8.3.1.8  Row Cycle definition
        9. 8.3.1.9  DLP9500 and DLP9500UV Input Data Formatting
        10. 8.3.1.10 DLP7000 and DLP7000UV Input Data Bus
        11. 8.3.1.11 DLP650LNIR Input Data Bus
      2. 8.3.2 Data Bus Operations
        1. 8.3.2.1 Row Addressing
        2. 8.3.2.2 Single Row Write Operation
        3. 8.3.2.3 No-Op Row Cycle Description
      3. 8.3.3 DMD Block Operations
        1. 8.3.3.1 Mirror Clocking Pulse (MCP)
        2. 8.3.3.2 Reset Active (RST_ACTIVE)
        3. 8.3.3.3 DMD Block Control Signals
          1. 8.3.3.3.1 Block Mode - BLK_MD1:0)
          2. 8.3.3.3.2 Block Address - BLK_AD(3:0)
          3. 8.3.3.3.3 Reset 2 Blocks - RST2BLK
        4. 8.3.3.4 DMD Block Operations
          1. 8.3.3.4.1 Global Reset (MCP) Consideration
      4. 8.3.4 Other Data Control Inputs
        1. 8.3.4.1 Complement Data
        2. 8.3.4.2 North/South Flip
      5. 8.3.5 Miscellaneous Control Inputs
        1. 8.3.5.1 ARST
        2. 8.3.5.2 CLKIN_R
        3. 8.3.5.3 DMD_A_RESET
        4. 8.3.5.4 Watchdog Timer Enable (WDT_ENABLE)
      6. 8.3.6 Miscellaneous Status Outputs
        1. 8.3.6.1 INIT_ACTIVE
        2. 8.3.6.2 DMD_Type(3:0)
        3. 8.3.6.3 DDC_VERSION(3:0)
        4. 8.3.6.4 LED0
        5. 8.3.6.5 LED1
        6. 8.3.6.6 DLPA200 Control Signals
        7. 8.3.6.7 ECM2M_TP_ (31:0)
    4. 8.4 Device Functional Modes
      1. 8.4.1 DLPC410 Initialization and Training
        1. 8.4.1.1 Initialization
        2. 8.4.1.2 input Data Interface (DIN) Training Pattern
      2. 8.4.2 DLPC410 Operational Modes
        1. 8.4.2.1 Single Block Mode
        2. 8.4.2.2 Single Block Phased Mode
        3. 8.4.2.3 Dual Block Mode
        4. 8.4.2.4 Quad Block Mode
        5. 8.4.2.5 Global Mode
        6. 8.4.2.6 DMD Park Mode
        7. 8.4.2.7 DMD Idle Mode
      3. 8.4.3 LOAD4 Functionality (enabled with DLPR410A)
        1. 8.4.3.1 Enabling LOAD4
        2. 8.4.3.2 Loading Data with LOAD4
        3. 8.4.3.3 Row Mapping with LOAD4
        4. 8.4.3.4 Using Block Clear with LOAD4
        5. 8.4.3.5 Timing Requirements for LOAD4
        6. 8.4.3.6 Global Binary Pattern Rate increases using LOAD4
        7. 8.4.3.7 Special LOAD4 considerations
    5. 8.5 Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Description
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Setup
      1. 9.3.1 Debugging Guidelines
      2. 9.3.2 Initialization
        1. 9.3.2.1 Calibration
        2. 9.3.2.2 DLPA200 Number 1 Initialization
        3. 9.3.2.3 DMD Initialization
          1. 9.3.2.3.1 DMD Device ID Check
          2. 9.3.2.3.2 DMD Device OK
        4. 9.3.2.4 DLPA200 Number 2 Initialization
        5. 9.3.2.5 Command Sequence Initialization
      3. 9.3.3 Image Display Issues
        1. 9.3.3.1 Present Data to DLPC410
        2. 9.3.3.2 Load Data to DMD
        3. 9.3.3.3 Mirror Clocking Pulse
  10. 10Power Supply Recommendations
    1. 10.1 Power Down Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLPC410 DMD Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
    3. 11.3 DLPC410 Chipset Connections
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイス・マーキング
      2. 12.1.2 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DLP|676
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
ELECTRICAL
Supply voltage (2) VCCINT –0.5 1.05 V
VCCO –0.5 3.45 V
VCCAUX 2.35 2.625 V
VI Input voltage (3) 2.5 V –0.75 VCCO + 0.5 V
VO Output voltage(4) 2.5 V –0.3 VCCO + 0.3 V
ENVIRONMENTAL
TA Operating free-air temperature(5) 0 85 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Applies to external input and bidirectional buffers.
(4) Applies to external output and bidirectional buffers.
(5) Maximum Ambient Temperature may be further limited by the device’s power dissipation (which is data and configuration dependent), air flow and resultant junction temperature.