DLPS253 September   2024 DLPC8445

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     6
    2. 4.1  Initialization, Board Level Test, and Debug
    3. 4.2  V-by-One Interface Input Data and Control
    4. 4.3  FPD Link Port(s) Input Data and Control (Not Supported in DLPC8445)
    5. 4.4  DSI Input Data and Clock (Not Supported in DLPC8445)
    6. 4.5  DMD SubLVDS Interface
    7. 4.6  DMD Reset and Low Speed Interfaces
    8. 4.7  Flash Interface
    9. 4.8  Peripheral Interfaces
    10. 4.9  GPIO Peripheral Interface
    11. 4.10 Clock and PLL Support
    12. 4.11 Power and Ground
    13. 4.12 I/O Type Subscript Definition
    14. 4.13 Internal Pullup and Pulldown Characteristics
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2.     22
    3. 5.2  ESD Ratings
    4. 5.3  Recommended Operating Conditions
    5. 5.4  Thermal Information
    6. 5.5  Power Electrical Characteristics
    7. 5.6  Pin Electrical Characteristics
    8. 5.7  DMD SubLVDS Interface Electrical Characteristics
    9.     29
    10. 5.8  DMD Low Speed Interface Electrical Characteristics
    11.     31
    12. 5.9  V-by-One Interface Electrical Characteristics
    13. 5.10 USB Electrical Characteristics
    14.     34
    15. 5.11 System Oscillator Timing Requirements
    16.     36
    17. 5.12 Power Supply and Reset Timing Requirements
    18.     38
    19. 5.13 V-by-One Interface General Timing Requirements
    20.     40
    21. 5.14 Flash Interface Timing Requirements
    22.     42
    23. 5.15 Source Frame Timing Requirements
    24.     44
    25. 5.16 Synchronous Serial Port Interface Timing Requirements
    26.     46
    27. 5.17 I2C Interface Timing Requirements
    28. 5.18 Programmable Output Clock Timing Requirements
    29. 5.19 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    30.     50
    31. 5.20 DMD Low Speed Interface Timing Requirements
    32.     52
    33. 5.21 DMD SubLVDS Interface Timing Requirements
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 V-by-One Interface
      3. 6.3.3 DMD (SubLVDS) Interface
      4. 6.3.4 Serial Flash Interface
      5. 6.3.5 GPIO Supported Functionality
        1.       63
      6. 6.3.6 Debug Support
  8. Power Supply Recommendations
    1. 7.1 System Power-Up and Power-Down Sequence
    2. 7.2 DMD Fast Park Control (PARKZ)
    3. 7.3 Power Supply Management
    4. 7.4 Hot Plug Usage
    5. 7.5 Power Supplies for Unused Input Source Interfaces
    6. 7.6 Power Supplies
      1. 7.6.1 Power Supplies DLPA3085
  9. Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Layout Guideline for DLPC8445 Reference Clock
        1. 8.1.1.1 Recommended Crystal Oscillator Configuration
      2. 8.1.2 V-by-One Interface Layout Considerations
      3. 8.1.3 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 8.1.4 Power Supply Layout Guidelines
    2. 8.2 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Device Nomenclature
      1. 9.5.1 Device Markings
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
      1. 9.8.1 Video Timing Parameter Definitions
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • AMD|484
サーマルパッド・メカニカル・データ
発注情報

Overview

The DLP® Products chipset consists of three components—the DLP472TP digital micromirror device (DMD), the DLPC8445 display controller, and the DLPA3085. The DLPC8445 display controller for the DMD formats incoming video and controls the timing of the DMD. It also controls DLPA3085 light source signal timing to coordinate with DMD timing to synchronize light output with DMD mirror movement. The DLPC8445 controller provides interfaces, such as V-by-One and SubLVDS (DMD interface) to minimize power consumption and EMI. Applications include mobile smart TVs, digital signage, and mobile home cinema.