Power and ground pins of each component shall be connected to the power and ground planes with a via for each pin. Avoid sharing vias to the power plane among multiple power pins, where possible. Trace lengths for component power and ground pins should be minimized (ideally, less than 0.100-inch). Unused or spare device pins that are connected to power or ground may be connected together with a single via to power or ground. The minimum spacing between vias shall be 0.050-inch to prevent slots from being developed on the ground plane.