DRV10983-Q1デバイスは三相のセンサレス・モータ・ドライバで、パワーMOSFETが内蔵されており、最大2Aまでの連続駆動電流を供給できます。このデバイスはコストを重視し、低ノイズで、外付け部品数の少ないファンやポンプ用途向けに特化して設計されています。™
DRV10983-Q1デバイスは最低4.5Vまでレジスタ設定を保持し、最低6.2Vの電源電圧でモータへ電流を供給します。電源電圧が28Vを超える場合、デバイスはモータの駆動を停止し、DRV10983-Q1の回路を保護します。この機能は、最高45Vまでの負荷ダンプ状況に対応できます。
デバイスのオプション:
型番 | パッケージ | 本体サイズ(公称) |
---|---|---|
DRV10983-Q1 | HTSSOP (24) | 7.80mm×6.40mm |
日付 | 改訂内容 | 注 |
---|---|---|
2017年6月 | * | 初版 |
The DRV10983-Q1 device uses a proprietary sensorless control scheme to provide continuous sinusoidal drive, which significantly reduces the pure tone acoustics that typically occur as a result of commutation. The interface to the device is designed to be simple and flexible. The motor can be controlled directly through PWM, analog, or I2C inputs. Motor speed feedback is available through both the FG pin and the I2C interface simultaneously.
The DRV10983-Q1 device features an integrated buck regulator to step down the supply voltage efficiently to 5 V for powering both internal and external circuits. The 3.3-V LDO also may be used to provide power for external circuits. The device is available in either a sleep mode or a standby mode version to conserve power when the motor is not running. The standby mode (8.5 mA) version (DRV10983SQ) leaves the regulator running and the sleep mode (48 μA) version (DRV10983Q) shuts the regulator off. Use the standby mode version in applications where the regulator is used to power an external microcontroller. Throughout this data sheet, the DRV10983-Q1 part number is used for both devices i.e. DRV10983Q (sleep version) and DRV10983SQ (standby version), except for specific discussions of sleep vs standby functionality.
An I2C interface allows the user to reprogram specific motor parameters in registers and to program the EEPROM to help optimize the performance for a given application. The DRV10983-Q1 device is available in a thermally-efficient HTSSOP, 24-pin package with an exposed thermal pad. The operating ambient temperature is specified from –40°C to 125°C.
PIN | TYPE (1) | DESCRIPTION | |
---|---|---|---|
N/AME | HTSSOP | ||
CPN | 3 | P | Charge pump pin 1, use a ceramic capacitor between CPN and CPP |
CPP | 2 | P | Charge pump pin 2, use a ceramic capacitor between CPN and CPP |
DIR | 14 | I | Direction; When low, phase driving sequence is U → V → W When high, phase driving sequence is U → W → V |
FG | 12 | O | FG signal output indicates speed of motor |
GND | 8 | P | Digital and analog ground |
PGND | 15, 16 | P | Power ground |
SCL | 10 | I | I2C clock signal |
SDA | 11 | I/O | I2C data signal |
SPEED | 13 | I | Speed control signal for PWM or analog input speed command |
SW | 4 | O | Step-down regulator switching node output |
SWGND | 5 | P | Step-down regulator ground |
U | 17, 18 | O | Motor U phase |
V | 19, 20 | O | Motor V phase |
V1P8 | 7 | P | Internal 1.8-V digital core voltage. V1P8 capacitor must connect to GND. This is an output, but is not specified to drive external loads. |
V3P3 | 9 | P | Internal 3.3-V supply voltage. V3P3 capacitor must connect to GND. This is an output and may drive external loads not to exceed IV3P3_MAX. |
VCC | 23, 24 | P | Device power supply |
VCP | 1 | P | Charge pump output, use a ceramic capacitor between VCP and VCC |
VREG | 6 | P | Step-down regulator output and feedback point |
W | 21, 22 | O | Motor W phase |
Thermal pad (GND) | — | P | The exposed thermal pad must be electrically connected to the ground plane by soldering to the PCB for proper operation, and connected to the bottom side of the PCB through vias for better thermal spreading. |