SLVSGJ9 May   2024 DRV7308

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Recommended Operating Conditions
  9. 8 Thermal Information
  10. 9 Electrical Characteristics
  11. 10Timing Diagrams
  12. 11Typical Characteristics
  13. 12Detailed Description
    1. 12.1 Overview
    2. 12.2 Functional Block Diagram
    3. 12.3 Feature Description
      1. 12.3.1 Output Stage
      2. 12.3.2 Input Control Logic
      3. 12.3.3 ENABLE (EN) Pin Function
      4. 12.3.4 Temperature Sensor Output (VTEMP)
      5. 12.3.5 Brake Function
      6. 12.3.6 Slew Rate Control (SR)
      7. 12.3.7 Dead Time
      8. 12.3.8 Current Limit Functionaity (ILIMIT)
      9. 12.3.9 Pin Diagrams
        1. 12.3.9.1 Four-Level Input Pin
        2. 12.3.9.2 Open-Drain Pin
        3. 12.3.9.3 Logic-Level Input Pin (Internal Pulldown)
    4. 12.4 Protections
      1. 12.4.1 GVDD Undervoltage Lockout
      2. 12.4.2 Bootstrap Undervoltage Lockout
      3. 12.4.3 Current Limit Protection
      4. 12.4.4 GaNFET Overcurrent Protection
      5. 12.4.5 Thermal Shutdown (OTS)
  14. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information
    1. 15.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • REN|68
サーマルパッド・メカニカル・データ
発注情報

6 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge (All other pins - pin names) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
V(ESD) Electrostatic discharge (VM, OUTx, BOOT, NCx) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.