JAJSJS9A july   2023  – july 2023 DRV8262

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
      1. 6.4.1 Transient Thermal Impedance & Current Capability
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Feature Description
    4. 7.4  Device Operational Modes
      1. 7.4.1 Dual H-Bridge Mode (MODE1 = 0)
      2. 7.4.2 Single H-Bridge Mode (MODE1 = 1)
    5. 7.5  Current Sensing and Regulation
      1. 7.5.1 Current Sensing and Feedback
      2. 7.5.2 Current Regulation
        1. 7.5.2.1 Mixed Decay
        2. 7.5.2.2 Smart tune Dynamic Decay
      3. 7.5.3 Current Sensing with External Resistor
    6. 7.6  Charge Pump
    7. 7.7  Linear Voltage Regulator
    8. 7.8  VCC Voltage Supply
    9. 7.9  Logic Level, Tri-Level and Quad-Level Pin Diagrams
    10. 7.10 Protection Circuits
      1. 7.10.1 VM Undervoltage Lockout (UVLO)
      2. 7.10.2 VCP Undervoltage Lockout (CPUV)
      3. 7.10.3 Logic Supply Power on Reset (POR)
      4. 7.10.4 Overcurrent Protection (OCP)
      5. 7.10.5 Thermal Shutdown (OTSD)
      6. 7.10.6 nFAULT Output
      7. 7.10.7 Fault Condition Summary
    11. 7.11 Device Functional Modes
      1. 7.11.1 Sleep Mode
      2. 7.11.2 Operating Mode
      3. 7.11.3 nSLEEP Reset Pulse
      4. 7.11.4 Functional Modes Summary
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving Brushed-DC Motors
        1. 8.1.1.1 Brushed-DC Motor Driver Typical Application
        2. 8.1.1.2 Power Loss Calculations - Dual H-bridge
        3. 8.1.1.3 Power Loss Calculations - Single H-bridge
        4. 8.1.1.4 Junction Temperature Estimation
        5. 8.1.1.5 Application Performance Plots
      2. 8.1.2 Driving Stepper Motors
        1. 8.1.2.1 Stepper Driver Typical Application
        2. 8.1.2.2 Power Loss Calculations
        3. 8.1.2.3 Junction Temperature Estimation
      3. 8.1.3 Driving Thermoelectric Coolers (TEC)
  10. 9 Package Thermal Considerations
    1. 9.1 DDW Package
      1. 9.1.1 Thermal Performance
        1. 9.1.1.1 Steady-State Thermal Performance
        2. 9.1.1.2 Transient Thermal Performance
    2. 9.2 DDV Package
    3. 9.3 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRICDDWDDVUNIT
RθJAJunction-to-ambient thermal resistance

22.2

44.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance

9.1

0.7

°C/W
RθJBJunction-to-board thermal resistance

5.3

18.9

°C/W
ψJTJunction-to-top characterization parameter

0.1

0.3

°C/W
ψJBJunction-to-board characterization parameter

5.3

18.6

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

0.7

N/A

°C/W
For the DDV package, as the exposed pad is on top of the package, RθJC(top) is the most important thermal resistance parameter.