JAJSN64 January   2022 DRV8316-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings AUTO
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 SPI Slave Mode Timings
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Output Stage
      2. 8.3.2  Control Modes
        1. 8.3.2.1 6x PWM Mode (MODE = 00b or MODE Pin Tied to AGND)
        2. 8.3.2.2 3x PWM Mode (MODE = 10b or MODE Pin is Connected to AGND with RMODE)
        3. 8.3.2.3 Current Limit Mode (MODE = 01b / 11b or MODE Pin is Hi-Z or Connected to AVDD)
      3. 8.3.3  Device Interface Modes
        1. 8.3.3.1 Serial Peripheral Interface (SPI)
        2. 8.3.3.2 Hardware Interface
      4. 8.3.4  Step-Down Mixed-Mode Buck Regulator
        1. 8.3.4.1 Buck in Inductor Mode
        2. 8.3.4.2 Buck in Resistor mode
        3. 8.3.4.3 Buck Regulator with External LDO
        4. 8.3.4.4 AVDD Power Sequencing on Buck Regulator
        5. 8.3.4.5 Mixed mode Buck Operation and Control
        6. 8.3.4.6 Buck Undervoltage Protection
        7. 8.3.4.7 Buck Overcurrent Protection
      5. 8.3.5  AVDD Linear Voltage Regulator
      6. 8.3.6  Charge Pump
      7. 8.3.7  Slew Rate Control
      8. 8.3.8  Cross Conduction (Dead Time)
      9. 8.3.9  Propagation Delay
        1. 8.3.9.1 Driver Delay Compensation
      10. 8.3.10 Pin Diagrams
        1. 8.3.10.1 Logic Level Input Pin (Internal Pulldown)
        2. 8.3.10.2 Logic Level Input Pin (Internal Pullup)
        3. 8.3.10.3 Open Drain Pin
        4. 8.3.10.4 Push Pull Pin
        5. 8.3.10.5 Four Level Input Pin
      11. 8.3.11 Current Sense Amplifiers
        1. 8.3.11.1 Current Sense Amplifier Operation
      12. 8.3.12 Current Sense Amplifier Offset Correction
      13. 8.3.13 Active Demagnetization
        1. 8.3.13.1 Automatic Synchronous Rectification Mode (ASR Mode)
          1. 8.3.13.1.1 Automatic Synchronous Rectification in Commutation
          2. 8.3.13.1.2 Automatic Synchronous Rectification in PWM Mode
        2. 8.3.13.2 Automatic Asynchronous Rectification Mode (AAR Mode)
      14. 8.3.14 Cycle-by-Cycle Current Limit
        1. 8.3.14.1 Cycle by Cycle Current Limit with 100% Duty Cycle Input
      15. 8.3.15 Protections
        1. 8.3.15.1 VM Supply Undervoltage Lockout (NPOR)
        2. 8.3.15.2 AVDD Undervoltage Lockout (AVDD_UV)
        3. 8.3.15.3 BUCK Undervoltage Lockout (BUCK_UV)
        4. 8.3.15.4 VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 8.3.15.5 Overvoltage Protections (OV)
        6. 8.3.15.6 Overcurrent Protection (OCP)
          1. 8.3.15.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 8.3.15.6.2 OCP Automatic Retry (OCP_MODE = 01b)
          3. 8.3.15.6.3 OCP Report Only (OCP_MODE = 10b)
          4. 8.3.15.6.4 OCP Disabled (OCP_MODE = 11b)
        7. 8.3.15.7 Buck Overcurrent Protection
        8. 8.3.15.8 Thermal Warning (OTW)
        9. 8.3.15.9 Thermal Shutdown (OTS)
          1. 8.3.15.9.1 OTS FET
          2. 8.3.15.9.2 OTS (Non FET)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (CLR_FLT or nSLEEP Reset Pulse)
      2. 8.4.2 DRVOFF functionality
    5. 8.5 SPI Communication
      1. 8.5.1 Programming
        1. 8.5.1.1 SPI Format
    6. 8.6 Register Map
      1. 8.6.1 STATUS Registers
      2. 8.6.2 CONTROL Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Three-Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Motor Voltage
          2. 9.2.1.1.2 Using Active Demagnetization
          3. 9.2.1.1.3 Driver Propagation Delay and Dead Time
          4. 9.2.1.1.4 Using Delay Compensation
          5. 9.2.1.1.5 Using the Buck Regulator
          6. 9.2.1.1.6 Current Sensing and Output Filtering
          7. 9.2.1.1.7 Power Dissipation and Junction Temperature Losses
        2. 9.2.1.2 Application Curves
      2. 9.2.2 Three-Phase Brushless-DC Motor Control With Current Limit
        1. 9.2.2.1 Block Diagram
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Motor Voltage
          2. 9.2.2.2.2 ILIM Implementation
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Brushed-DC and Solenoid Load
        1. 9.2.3.1 Block Diagram
        2. 9.2.3.2 Design Requirements
          1. 9.2.3.2.1 Detailed Design Procedure
      4. 9.2.4 Three Solenoid Loads
        1. 9.2.4.1 Block Diagram
        2. 9.2.4.2 Design Requirements
          1. 9.2.4.2.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 サポート・リソース
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.1 Overview

The DRV8316-Q1 device is an integrated95-mΩ (combined high-side and low-side MOSFET's on-state resistance) driver for 3-phase motor-drive applications. The device reduces system component count, cost, and complexity by integrating three half-bridge MOSFETs, gate drivers, charge pump, current sense amplifiers, linear regulator for the external load and buck regulator. A standard serial peripheral interface (SPI) provides a simple method for configuring the various device settings and reading fault diagnostic information through an external controller. Alternatively, a hardware interface (H/W) option allows for configuring the most commonly used settings through fixed external resistors.

The architecture uses an internal state machine to protect against short-circuit events, and protect against dv/dt parasitic turnon of the internal power MOSFET.

The DRV8316-Q1 device integrates three, bidirectional current-sense amplifiers for monitoring the current level through each of the half-bridges using a built-in current sense. The gain setting of the amplifier can be adjusted through the SPI or hardware interface.

In addition to the high level of device integration, the DRV8316-Q1 device provides a wide range of integrated protection features. These features include power-supply undervoltage lockout (UVLO), charge-pump undervoltage lockout (CPUV), overcurrent protection (OCP), AVDD undervoltage lockout (AVDD_UV), buck regulator ULVO for DRV8316-Q1 and overtemperature shutdown (OTW and OTSD). Fault events are indicated by the nFAULT pin with detailed information available in the SPI registers on the SPI device version.

The DRV8316R-Q1 and DRV8316T-Q1 device are available in 0.5-mm pin pitch, VQFN surface-mount packages. The VQFN package size is 7 mm × 5 mm.