SLVS854E July   2008  – December 2014 DRV8809

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interface
        1. 7.3.1.1 Setup Mode/Power-Down Mode
        2. 7.3.1.2 Extended Setup Mode
        3. 7.3.1.3 Serial Interface Timing
        4. 7.3.1.4 Bipolar Current Regulated Stepper Motor Drive
        5. 7.3.1.5 Short/Open for Motor Outputs
        6. 7.3.1.6 DCDC_MODE for Parallel-Mode Control
        7. 7.3.1.7 DCDC_MODE and C_SELECT Timing Delay and Start-Up Order
        8. 7.3.1.8 In-Reset: Input for System Reset
        9. 7.3.1.9 Blanking Time Insertion Timing for DC Motor Driving
      2. 7.3.2 Motor Driver Configuration
      3. 7.3.3 Charge Pump
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With 7 V < VM and VDIN < 18 V
      2. 7.4.2 Operation With 18 V ≤ VM and VDIN ≤ 40 V
    5. 7.5 Register Maps
      1. 7.5.1 Setup Register Bit Assignment
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage for Each DC-DC Converter
        2. 8.2.2.2 Output Voltage Startup Sequence
        3. 8.2.2.3 Motor Configuration
        4. 8.2.2.4 External Rsense-Motor Current Setting for Stepping Motor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

10.1 Layout Guidelines

  • VDIN and VM should be connected externally
  • Recommended to have GND plane layer for better thermal performance. Thermal pad directly going down to GND layer just under the device is the best way.
  • VM is an analog sensing pin, not a power supply. Monitor the voltage between VM and RSx pin.
  • Distance between Odx to Inductance should be as close as possible. This line has switching from 0 V to VDIN.
  • FBx pin and external feedback resistor should be as close as possible. This is the analog sensing pin for the DC-DC converter.

10.2 Layout Example

layout_lvs854.gifFigure 38. Layout