JAJSM96 may   2023 DRV8849

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Indexer Timing Requirements
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Stepper Motor Driver Current Ratings
        1. 8.3.1.1 Peak Current Rating
        2. 8.3.1.2 RMS Current Rating
        3. 8.3.1.3 Full-Scale Current Rating
      2. 8.3.2 Microstepping Indexer
      3. 8.3.3 Controlling VREF with an MCU DAC
      4. 8.3.4 Current Regulation and Decay Modes
        1. 8.3.4.1 Smart tune Ripple Control
        2. 8.3.4.2 Smart tune Dynamic Decay
        3. 8.3.4.3 Blanking time
      5. 8.3.5 Charge Pump
      6. 8.3.6 Logic Level, tri-level and quad-level Pin Diagrams
      7. 8.3.7 nFAULT Pins
      8. 8.3.8 Protection Circuits
        1. 8.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 8.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 8.3.8.3 Overcurrent Protection (OCP)
          1. 8.3.8.3.1 Latched Shutdown
          2. 8.3.8.3.2 Automatic Retry
        4. 8.3.8.4 Thermal Shutdown (OTSD)
          1. 8.3.8.4.1 Latched Shutdown
          2. 8.3.8.4.2 Automatic Retry
        5. 8.3.8.5 Fault Condition Summary
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode (nSLEEP = 0)
      2. 8.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      3. 8.4.3 Operating Mode (nSLEEP = 1, ENABLE = Hi-Z/1)
      4. 8.4.4 nSLEEP Reset Pulse
      5. 8.4.5 Functional Modes Summary
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
        4. 9.2.2.4 Application Curves
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Bulk Capacitance
  12. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連資料
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC

QFN

UNIT
RθJAJunction-to-ambient thermal resistance

29.9

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

19.5

°C/W
RθJBJunction-to-board thermal resistance

11.6

°C/W
ψJTJunction-to-top characterization parameter

0.3

°C/W
ψJBJunction-to-board characterization parameter

11.6

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

4.1

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.